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ECD Thermosphere Collective IQ

The ECD Thermosphere Collective IQ is a collaboration of shared intelligence with Thermal Measurment as the primary focus.


ECD M.O.L.E.® Thermal Profiling - TAL

Term: TAL
2 post(s) found

Total Heat – Another way to analyze your thermal profile

Posted on Jan 21, 2011

One of the most popular ways to determine if a thermal profile of an electronic assembly is within specification is to consider the limits placed on four measurements or parameters: Initial Ramp Slope, Soak time, Time Above Liquidus and Peak temperature. Keep these four parameters within the specified (solder paste) limits and you can be assured that you are soldering the parts without damaging them.
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The Cooling Zone

Posted on Nov 18, 2010

A sometimes forgotten fact about reflow and wave soldering is that anywhere from 25% to 50% of the time a solder joint spends above its melting temperature, aka: time above liquidus (TAL), takes place in the "cooling zone". Much time is spent getting the heating portion of the oven recipe finely tuned to produce a robust thermal profile, only to toss the product, covered with liquefied solder into a cooling zone where the solder joints must return to a solid state. The rate at which this occurs (cooling slope) is even more critical using lead- free solders. Giving the cooling zone some well deserved attention when defining the requirements of the thermal profile is essential to a good Thermal Quality Management program for your soldering process.
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