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ECD Thermosphere Collective IQ

The ECD Thermosphere Collective IQ is a collaboration of shared intelligence with Thermal Measurment as the primary focus.


Total Heat – Another way to analyze your thermal profile

Posted on Jan 21, 2011

One of the most popular ways to determine if a thermal profile of an electronic assembly is within specification is to consider the limits placed on four measurements or parameters: Initial Ramp Slope, Soak time, Time Above Liquidus and Peak temperature. Keep these four parameters within the specified (solder paste) limits and you can be assured that you are soldering the parts without damaging them.
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The Cooling Zone

Posted on Nov 18, 2010

A sometimes forgotten fact about reflow and wave soldering is that anywhere from 25% to 50% of the time a solder joint spends above its melting temperature, aka: time above liquidus (TAL), takes place in the "cooling zone". Much time is spent getting the heating portion of the oven recipe finely tuned to produce a robust thermal profile, only to toss the product, covered with liquefied solder into a cooling zone where the solder joints must return to a solid state. The rate at which this occurs (cooling slope) is even more critical using lead- free solders. Giving the cooling zone some well deserved attention when defining the requirements of the thermal profile is essential to a good Thermal Quality Management program for your soldering process.
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Thermal Profiling and Vapor Phase Soldering

Posted on Sep 09, 2010

There has been some new talk by some of the best quality conscious electronic manufactures about the many benefits of an older soldering process: vapor phase soldering. Vapor phase soldering has a lot of good things to offer, now that we have gotten past the stigma of the old CFC fluids and moved on to newer chemistries. The maximum temperature that the assembly can be subjected to is dictated by the boiling point of the fluid being vaporized. Because the boiling point of the fluid is a physical constant, you might think, “Why bother running a thermal profile on the assembly being soldered.” This idea should be considered carefully, and here are some reasons why thermal profiling in vapor phase soldering is still a very good idea: 1. Although the boiling point of the vapor phase fluids is a physical attribute that limits the maximum temperature, the condensation of the fluid onto the components can impart a lot of heat, real fast. This can subject components t ...
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Posted on Jun 28, 2010

Yes I know, I’m ripping off the Car Talk radio program name, the truly funny call-n show where two well educated brothers have the best of fun giving advise (correct for the most part) to their call-in victims about everything from car repairs to personal relationships. If you’ve not heard the program, find your local NPR radio station and check it out. And also, I’m following on the heels of Board Talk, a web based collection of questions and answers by two respected members of the electronic assembly community who do a nice job (in a “Car Talk” like format) of answering many common questions submitted by followers of the Circuitmart web based electronic assembly resource.
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On Reflow Soldering

Posted on May 03, 2010

You know, at ECD we have been in the thermal profiling business for over 25 years. Most of what we profile is the reflow soldering process. There are many others like wave soldering, baking, drying, curing, and a host of other industrial temperature process. Still, reflow soldering is the most popular use for a thermal profiler like the MOLE. And yet, most of what can be found on the subject of reflow soldering, at least on the web, focuses on specific portions of the reflow process and not on the entire process as a whole.

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The Fastest Way to Know Your profile is “OK”

Posted on Feb 25, 2010

Now there is a way to verify that your profile requirements are being met in less time than you ever thought possible. The letters in the name M.O.L.E.® thermal profiler have always stood for Multi-channel Occurrent Logger Evaluator. Now the patented* "OK button" feature truly makes "E" in M.O.L.E. a reality, because now the MOLE profiler can automatically compare the measured temperature profile to your pre-programmed profile requirements.

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Why do an Oven HealthCHECK™? Why Calibrate Instruments?

Posted on Jan 27, 2010

Why do an Oven HealthCHECK™? Why Calibrate Instruments?

You might ask, why should I perform an Oven HealthCHECK? In other words, why should I run a rather sophisticated measurement system through my oven to produce a rather nice looking 3-D plot of the cross belt temperature uniformity?

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GR&R as it applies to ECD products – OvenCHECKER™, OvenRIDER®, WaveRIDER® and MEGARIDER®

Posted on Nov 06, 2009

Gage Repeatability and Reproducibility (GR&R) studies are designed to show the amount of variation certain portions of the measurement system contribute to the total variation in measurement, often expressed in percent. There are many ways and products available to help you calculate these numbers, which range from a piece of graph paper to full blown software packages costing 1000s of dollars.

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