Over 80% of the available USB/RS-232 Serial adapters are not compatible. Use only ECD approved P/N: Y23-7782-10 (Quatech SS-USB-100).

Send your M.O.L.E.® Thermal Profiler in to the ECD Service Department. Fill out this RMA Form to proceed. To calibrate your M.O.L.E. Thermal Profiler, use procedure: M.O.L.E.® Calibration

For M.O.L.E.® MAP installation instructions, refer to the ECD MAP Software visual tutorial

Thermocouple Insulation Type There are many kinds of insulation used over thermocouple wire. Here are a few of the most popular, and their advantages and disadvantages...

Last week, local Milwaukie-based technology firm, ECD, hosted vendors, customers and partners at a special event to celebrate the company’s 50th year. With products and services designed and manufactured to enable the printed circuit board assembly and baking processes, ECD is best known for its former aqueous cleaning systems and for revolutionizing electronics thermal processes with the development of the M.O.L.E.® suite of thermal profiling tools. ECD’s rich history includes broad experience in electronics and other industries including baking, industrial and solar...

ECD continues to expand its business to support its growing customer base and today announced the addition of two new representative firms, as well as a relationship with a European-based calibration service...

ECD has reached a milestone, celebrating its 50th year and the numerous innovative products and companies it has been a part of over the last half-century. Best known for its former aqueous cleaning systems and for revolutionizing electronics thermal processes with the development of the M.O.L.E.® suite of thermal profiling tools, ECD’s rich history includes broad experience in electronics and other industries including baking, industrial and solar.

We suspect the issue visible on the attached image is due to contamination on this component lead. We only see this issue on one component type, and only on one side of the component.

Here is one possible cause to check on before you apply the failure to the component.

An often misunderstood concept is heat flow and how it can influence the temperature of the product being heated so here is Wikipedia’s definition of heat flow, followed by a discussion of our own on the subject.

Attaching thermocouples in Vapor Phase Soldering (VPS) presents a potential problem that’s often overlooked. To illustrate this potential problem, let’s look at how VPS works. All the work needed to heat the components and solder joints to the melting temperature of the solder take place in the very thin “condensate” layer of liquefied vapor phase fluid. This 0.2 mm layer is very much like the layer of water that forms on a cold drink on a humid summer day. (See figure 1.) The vaporized fluid (cloud) is at or very near the boiling temperature of the fluid, which is typically 200ºC to 240ºC, depending on the fluid you choose to use.