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ECD Thermosphere Collective IQ

The ECD Thermosphere Collective IQ is a collaboration of shared intelligence with Thermal Measurment as the primary focus.

 

ECD M.O.L.E.® Thermal Profiling - Reflow Soldering

Term: Reflow Soldering
3 post(s) found

Heat Flow Happens

Posted on May 24, 2011

An often misunderstood concept is heat flow and how it can influence the temperature of the product being heated so here is Wikipedia’s definition of heat flow, followed by a discussion of our own on the subject.
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The Cooling Zone

Posted on Nov 18, 2010

A sometimes forgotten fact about reflow and wave soldering is that anywhere from 25% to 50% of the time a solder joint spends above its melting temperature, aka: time above liquidus (TAL), takes place in the "cooling zone". Much time is spent getting the heating portion of the oven recipe finely tuned to produce a robust thermal profile, only to toss the product, covered with liquefied solder into a cooling zone where the solder joints must return to a solid state. The rate at which this occurs (cooling slope) is even more critical using lead- free solders. Giving the cooling zone some well deserved attention when defining the requirements of the thermal profile is essential to a good Thermal Quality Management program for your soldering process.
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On Reflow Soldering

Posted on May 03, 2010

You know, at ECD we have been in the thermal profiling business for over 25 years. Most of what we profile is the reflow soldering process. There are many others like wave soldering, baking, drying, curing, and a host of other industrial temperature process. Still, reflow soldering is the most popular use for a thermal profiler like the MOLE. And yet, most of what can be found on the subject of reflow soldering, at least on the web, focuses on specific portions of the reflow process and not on the entire process as a whole.

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