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Temperature and time are variables in PCB soldering that must be tightly controlled for a good outcome. It’s a balancing act, indeed. PCB assemblies have to be processed at a high enough temperature for a long enough period of time to form good solder joints, but overshooting the temperature or heating the assembly too quickly can damage components. Of course, insufficient heat also has detrimental results which can cause poor soldering and long-term reliability issues.
The only way to get time and temperature just right is to measure and analyze. That’s what ECD does best. Our 50+ years of innovative product development has yielded the most comprehensive portfolio of Thermal Profiling technology tools to ensure that electronics thermal processes are in control.
Select the area of interest to learn more:
Dry Storage
Flux and Wave Solder
Reflow Oven
In-Line Curring
Printed Circuit Board (PCB) profiling tools are used to create a repeatable thermal process that meets the specifications required by the solder paste and/or component manufacturers. Only through proper profiling can the actual component temperatures within a reflow soldering process become known. There are two major objectives for thermal profiling:
Barriers & Thermocouples
Process repeatability can be easily verified by the production operator through the use of tools that are fit for purpose.
Once a reflow oven recipe is developed, Machine Quality Management tools, profile the machine (as opposed to the PCB). Keeping a machine in spec is just as important as developing the right board profile. ECD’s MQM tools are ease to use and deliver data that shows the repeatability/capability of the machine.
To ensure maximum product quality, real-time continuous monitoring offers ongoing detailed product information, including:
Ramp
Soak
Spike
Peak
Time Above
Max Slope
Conveyor Speed
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