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MegaMOLE 20
20 Channel Thermal Profiler
SuperMOLE Gold 2
6 Channel Thermal Profiler
V-MOLE
3 Channel Thermal Profiler
V-MOLE Solar
MiniMOLE rH
Relative Humidity Logger
WaveRIDER
Simplify your Wave Solder setup
OvenCHECKER
Reflow Process Verification
OvenRIDER
Convection Reflow Oven Verification
Fluxometer
Maximize Yields and Reduce Rework
Temprobe
PCB Precise Sensing Instrument
SideRIDER
Expandable Profiler Carrier
E-Z RIDER
Wave Solder Profiler Carrier
Reflow RIDER
Reflow Oven Profiler Carrier
Board Carrier
PCB Board Carrier
OvenWATCH
Continuous PCB Monitoring System
OvenSENTINEL
Intelligent Monitoring Solutions
MOLE MAP
ECD's Main Profiling Software
Profile Planner
Develop Robust Temperature Profiles
SuperMOLE Gold SPC
Powerful Software. Easy to Use
SD-10
10 cu ft Dry Cabinet
SD-30
30 cu ft Dry Cabinet
SD-48F
48 cu ft Dry Cabinet
Product Calibration
ISO 17025 Accredited
RMA Request
Return ECD product
Support Request
Hardware or Software Support
FAQ
Frequently Asked Questions
Blog
Thermosphere Collective IQ
Videos
How-to, Visual Tutorials, and More
Resources And Links
Industry web resources and links
ECD
Worldwide Headquarters
Sales Representative
Local Sales Representative
Whether you’re barbecuing a steak or casting high nickel turbine fan blades the amount of both in combination is crucial in achieving product perfection. Taking a recipe out of a data sheet or translating metallurgical charts and tables into furnace settings is one thing. However, to prove the staging of theoretical best-practices actually imparts the desired material properties requires direct measurement of the work piece.
This is where the ECD M.O.L.E.® excels, and INDATA™ thermal profiling systems travel with your parts through conveyorized ovens and furnaces, eliminating the need for long feed-and-retrieve sensor wires.
Consult your solution
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Traveling Time/Temperature Profiling and Analysis is ECD's forte, and the kits built around the SuperM.O.L.E.® Gold 2 with our INDATA® line of thermal barriers and thermocouples create custom solutions for your time at temperature and space constraints. Kits also include M.O.L.E.® MAP software, which flexes with your workflow, providing customizable data extractions, Imports of your .MDM M.O.L.E.® libraries and compatibility with your intranet, Excel, and all ECD M.O.L.E.® profilers. M.O.L.E.® MAP is the Gold Standard for thermal profiling software.
Six-channel Time/Temperature Profilers are the most popular for process heating applications. When you need more data points the MEGAM.O.L.E.® 20 is your choice for furnace surveys and other product quality assurance needs, including new product development.
With only one M.O.L.E.®, you can obtain graphs in M.O.L.E.® MAP software with 20 profile channels, and get the data in real time as well! Meanwhile, our three channel model, the V-M.O.L.E.® accepts 3 Mini thermocouples in a size ideal for batch and flat bed curing processes, powder coat curing and photovoltaic metallization and lamination quality assurance.
Measurement and Control of the Time/Temperature process to the yield, quality and throughput of most every manufacturer or producer of sold goods. Innovation through R&D also relies heavily upon thermal process data analysis to optimize a company's reputation as well as profitability. Manufacturing is alive and well! These are examples of such industries where ECD's thermal profiling customers reside:
Aluminum Fabrication
Automotive
Baking & Food Processing
Carpet & Textiles
Electronics & Semiconductor
Ferrous Heat Treating
Glass Manufacture
Gold Clubs & Sports Equipment
Hand Tools
MDF Cabinetry
Medical
Military/Aerospace
Plastics & Rotomoulding
Powder Coating
Powder Metallurgy
Smart Grid
Solar PV Manufacture
Tractors & Lawn Mowers
INDATA™ enhancements extend the range of applications for thermal profiling beyond relatively small ovens of short process duration. Any conveyorized or batch process for which a thermal barrier can be designed that satisfies the time/temperature protection for the M.O.L.E.® while retaining compatibility with workspace restrictions.
Thermal Barrier is an insulation and passive heatsinks protects 3, 6 and 20-channel ECD M.O.L.E.® profilers.
All of our thermocouples have been specifically designed and tested for use in thermal profiling. We offer a wide range of thermocouples, whether you are in electronic product manufacturing, industrial food process applications such as baking or in high temp annealing.
A Southern food products plant utilizes SuperM.O.L.E.® Gold thermal profiling in their nut roasting operation, utilizing the BB-80 thermal barrier for their ECD profiler and 6 teflon-coated thermocouples arranged in 3 tubes placed across the 15-foot belt width into the bed depth of splits. Lateral balance as well as throughput optimization are accomplished for preferred end product appearance and optimized profitability, with an eye always on Time Above Temperature for periodic FDA safety reporting requirements for salmonella-free certification.
A US Textile company uses the SuperM.O.L.E.® Gold to optimize blowers and heaters to achieve their dryness specification (after stain resistance coating) while optimizing throughput too, removing a process bottle neck. The ECD M.O.L.E.® is also used to validate the backing adhesive curing cycle.
A US glass manufacturer uses the 20-channel MegaM.O.L.E.® 20 to profile large 10' x 6' glass panels. The use of 20 thermocouples allows them to characterize the perimeter and the field of the large panels so that they can verify how uniform surface temperatures are during the IR heating process. The output is electronically tintable glass for windows and skylights that allow you to manage glare and heat.
A Manufacturer of hand tools here in the United States profiles their box and conveyorized furnaces with the SuperM.O.L.E.® Gold 2, certifying their Tempering and Hardening cycles with MAP software reporting data to distinguish their high quality in a crowded marketplace.
Operating multiple conveyorized heat treat furnaces, profiling parts with very long feed-and-retrieve thermocouples was a pain. Now, rather than occasionally measuring only one or two parts to Verify Safety Standards Quality, they are profiling on a regular basis with up to 20 inconel thermocouples (drilled hole into the work-piece) with the ECD MEGAM.O.L.E.® 20 in a customized INDATA™ 100=MMZ thermal barrier – complete with micro porous insulation, phase-change heat sinks, and Nano-to-Mini thermocouples adapter. Since the INDATA™ profiler travels on the belt along with the product, the thermocouples are but 12" to 24" long, exiting from slots out the sides of the thermal barrier, designed to protect the profile rig through this 600°C to 760°C process.
The powder supplier will profile their customer´s cure oven to ensure optimum trouble-free use of their product´s unique capabilities. The contract coater, vertically integrated manufacturer and OEM's ensure their Cure Schedule meets design criteria for long term environmental quality and finish appearance for company reputation and as a sales tool for demonstrating process control. A large work piece can be exposed to temperatures that are quite different near the hook compared to near the floor. Likewise, the complex part with thick and thin areas must all cure properly, and placing a thermocouple sensor on each area while monitoring oven air temperature is the key to Cure Schedule Quality.
Please spend a moment to consider the nature of your thermal process and it’s physical constraints then Continue the conversation with our technical sales staff via email and/or phone at your convenience.
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