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ECD M.O.L.E.® Thermal Profiling - White Paper

Term: White Paper
19 post(s) found

Is Your Dry Storage J-Standard Compliant?

Posted on Jun 25, 2020

What is J-Standard compliance and why should you care? Is your operation in full compliance? Is your team adopting practices that may be sacrificing compliance? What’s your confidence level that moisture sensitive components have been stored correctly? With the abundance of misleading information, outdated practices, and simple lack of understanding, you may be at risk of unintentionally producing suspect assemblies.

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How To Get The Best Thermal Profile

Posted on May 31, 2019

This paper provides an overview of thermocouple construction and function, as well as detail on how to size and spec the appropriate thermocouple for the application. Pros and cons of various thermocouple attachment methods are also presented.
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Dispelling Dry Storage Myths

Posted on May 07, 2019

Most electronics professionals know it’s important for parts to be dry before sending them through the soldering process. There are, however, some common misconceptions about drying components and the best way to ensure moisture sensitive devices (MSDs) are ready for soldering.

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Oven vs. Product Profiling

Posted on May 01, 2019

Thermal profiling is a recognized necessity for high-yield electronics assembly. As quality requirements dictate reflow process measurement, it is beneficial to understand which measurement and verification options are best for specific circumstances. One consideration is whether to profile the product (often referred to as the ‘golden board’) or the oven. This paper will present information that illustrates how oven profiling can be a more effective and beneficial approach versus that of product profiling. Parameters for successful implementation are also discussed.
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Heat Flow for Reflow

Posted on Jan 25, 2019

An often misunderstood concept in reflow soldering is heat flow and how it can influence the temperature of the product being heated. Controlling the reflow oven soldering process requires monitoring not only temperature but also heat flow. Since heat flow is what causes objects to increase in temperature, measuring your oven’s ability to increase the temperature of fixed thermal mass objects will allow you to detect variation in heat flow. By observing the temperature rise in the mass over a fixed amount of time, you can discover if the same amount of heat has been transferred into the mass. Such a measurement, combined with ambient temperature, yields a much more complete assessment of a reflow oven. Only by knowing the heat flow capacity of an oven can you be assured that the oven will heat your circuit boards at the same rate and to the same temperature, every time. This assures maximum yield and quality in the reflow process.

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Classic PCB Thermal Profiling of the Reflow Solder Process

Posted on May 01, 2011

Classic printed circuit board (PCB) profiling involves connecting thermocouples from your PCB assembly to a data recording profiling instrument and running the assembly through your reflow oven. Profiling has two primary objectives: 1) determining the correct process settings for a given PCB assembly and 2) verifying process consistency to ensure repeatable results. By viewing the actual temperatures (thermal profile) of a PCB while it travels through the reflow oven, once can verify and/or correct oven settings to achieve optimum quality for the finished product.

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Reflow Soldering – The Basics

Posted on May 20, 2010

Reflow soldering is a thermal process which is designed to melt a solder paste (a mixture of solder alloy powder with a solder flux to form a tacky paste) which has been placed on the exposed conductive pads of a circuit board and the contacts or leads of an electronic device to form a solder joint.

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