Reflow soldering is a thermal process which is designed to melt a solder paste (a mixture of
solder alloy powder with a solder flux to form a tacky paste) which has been placed on the
exposed conductive pads of a circuit board and the contacts or leads of an electronic device to
form a solder joint.
SMT components can be as small as 0.005” x 0.010” (0.13mm x 0.26mm) and as large as 6
square inches (4000 square mm). The components are so small, and require such precision
when placing them on the circuit boards, that equipment called pick and place machines must
be used to pick up and place them on the circuit boards.
Reflow soldering is the most popular way of melting solder to form good solder joints and can
be used to process anywhere from dozens to many thousands of solder joints, all at the same
time as the circuit boards progress through a reflow oven, typically on a conveyor belt or side
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