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Process Improvement Through Thermal Profiling

Posted on Jan 10, 2005

The goal of thermal profiling is to always increase quality and reduce waste. Three case histories - covering powder coating, baking and solder reflow applications - show you how three manufacturers achieved these goals.

All heating process have one thing in common: the "process window" (figure 1). This is the area where time and temperature come into perfect synchronization. In electronics, it is the point when solder melts to form the perfect electrical connection. In baking, it is where bread reaches the optimum temperature to create a perfect loaf. For powder-coat curing, it is the point where the process melds the coating into a permanent seal with the base material of the product.

Typical types of equipment used for temperature control include:

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