ECD M.O.L.E.® Thermal Profiling - Press Release

Thermal Profiling and Process Verification Leader Boasts Most Comprehensive Soldering Offer with Debut of Selective Soldering Tool

November 17, 2020 – ECD today announced the addition of SelectiveRIDER™ to its portfolio of soldering process measurement pallets, effectively closing the loop to deliver a complete line of automated verification technologies for every machine soldering process: wave, reflow and selective. Like all ECD verification RIDERs, the selective soldering measurement pallet integrates with the SuperM.O.L.E. Gold 2® thermal profiler and ECD’s M.A.P. software for a seamless, optimized solution.

OvenSENTINEL™ Earns ECD Top Honors; Second-Generation set to Make Debut

Reflow Soldering Monitoring Software’s Scalability, Extreme Traceability Recognized for Importance to Industry

October 6, 2020 – OvenSENTINEL™, ECD’s distinctive reflow soldering continuous monitoring technology, was honored with a Global Technology Award just as its second-generation version is set to hit the market. The award ceremony, which took place virtually last month, highlighted OvenSENTINEL’s top ranking in the process control software category based on the innovation’s unique feature set.

Essentium and ECD Partner to Develop DryBox, an Intelligent Storage System for Industrial-Scale 3D Printing

Delivers optimum environment for materials, extends shelf life, yields more consistent prints, produces better part quality

Austin, Texas, September 29, 2020 - Essentium, Inc., today launched the Essentium DryBoxTM, a next-generation cabinet designed to store and protect 3D printing filaments in a humidity-controlled environment. Essentium worked in partnership with leading intelligent dry storage system innovator, ECD, to develop DryBox exclusively for 3D printer material requirements.

June 9, 2020–Thermal profiling pioneer ECD has developed a five-module course that provides electronic assembly specialists with a thorough overview of thermal profiling  basics.Designed as an introductory tool for new operators or a fundamentals refresher for seasoned engineers, ECD’s Thermal Profiling course, which only recently went live, has  received overwhelmingly positive reviews.

April 6, 2020 – ECD today announced that Mike Hayward will lead the company’s operations in the EMEA region where he will oversee product sales, channel partnerships, customer technical support and strategic relationships. Hayward, who has an extensive technical background and has worked in the electronics industry for over 35 years, previously held a similar role with ECD and is delighted to re-join the company to help lead growth initiatives as the Director of EMEA Operations.

February 12, 2019 – Lauded for its simplicity, sleek design, unique feature set and unmatched recovery performance, ECD’s SmartDRY™ Intelligent Dry Storage system has further validated its market-leading status with top rankings from those who matter most – its customers. With its first-ever entry into Circuits Assembly magazine’s Service Excellence Awards program, SmartDRY™ locked up the component storage systems category with a decisive win, earning high marks from current customers in each of five critical areas: dependability, quality, responsiveness, technology, and value for the price.

October 30, 2018 – Thermal profiling leader ECD, designer and developer of M.O.L.E.® brand thermal measurement systems, today announced the release of its redesigned Temprobe™ non-destructive temperature sensing technology. The temperature measurement tool, used primarily for high-value assemblies where conventional thermocouples are not an option, has been re-engineered for increased robustness and longevity.

March 21, 2018 – At the upcoming NEPCON China event, set to take place April 24 – 26 in Shanghai, thermal process characterization and verification leader ECD debuts its brand new continuous monitoring technology, OvenSENTINEL™, to the Chinese electronics market. Also on display are its M.O.L.E.® and OvenRIDER® technologies; the premiere tools for high-reliability, high-yield thermal processing results. Exhibiting with local distributor WKK in booth # 1H30, ECD invites show delegates to learn more about OvenSENTINEL, the full line of M.O.L.E. profilers, the latest M.O.L.E. MAP software and the newly-designed OvenRIDER NL2+.

May 10, 2017 – ECD is recognized globally for its pioneering work in advanced thermal process measurement technologies. Central to the development of the company’s award-winning products are its knowledgeable people, many of whom lend their expertise to important industry initiatives. Such is the case with ECD’s Senior Project Engineer, Paul Austen, who was a member of and contributor to the standards committee that wrote the IPC-7530 “Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)”, IPC-7801 “Reflow Oven Process Control Standard”, and who also shared his expertise for the most recent revision of IPC-7530A, which was released this year. Paul, along with other committee members, was honored for his contributions at the annual awards luncheon hosted by the IPC at this year’s APEX event in San Diego, California.