ECD M.O.L.E.® Thermal Profiling - Press Release

October 30, 2018 – Thermal profiling leader ECD, designer and developer of M.O.L.E.® brand thermal measurement systems, today announced the release of its redesigned Temprobe™ non-destructive temperature sensing technology. The temperature measurement tool, used primarily for high-value assemblies where conventional thermocouples are not an option, has been re-engineered for increased robustness and longevity.

March 21, 2018 – At the upcoming NEPCON China event, set to take place April 24 – 26 in Shanghai, thermal process characterization and verification leader ECD debuts its brand new continuous monitoring technology, OvenSENTINEL™, to the Chinese electronics market. Also on display are its M.O.L.E.® and OvenRIDER® technologies; the premiere tools for high-reliability, high-yield thermal processing results. Exhibiting with local distributor WKK in booth # 1H30, ECD invites show delegates to learn more about OvenSENTINEL, the full line of M.O.L.E. profilers, the latest M.O.L.E. MAP software and the newly-designed OvenRIDER NL2+.

May 10, 2017 – ECD is recognized globally for its pioneering work in advanced thermal process measurement technologies. Central to the development of the company’s award-winning products are its knowledgeable people, many of whom lend their expertise to important industry initiatives. Such is the case with ECD’s Senior Project Engineer, Paul Austen, who was a member of and contributor to the standards committee that wrote the IPC-7530 “Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)”, IPC-7801 “Reflow Oven Process Control Standard”, and who also shared his expertise for the most recent revision of IPC-7530A, which was released this year. Paul, along with other committee members, was honored for his contributions at the annual awards luncheon hosted by the IPC at this year’s APEX event in San Diego, California.

April 19, 2017 – ECD is celebrating the company’s most successful year on record, as 2016 is now in the books and closed with significant financial and product development achievements. Strategic focus, a new product line, enhancements to existing technologies, award-winning service and a dedicated team are all cited as key contributors to the record-breaking result.

March 1, 2017 – ECD is celebrating its recent Service Excellence Award win, which marks the second consecutive such accolade for the thermal profiling and dry storage technology pioneer. The awards contest, sponsored by Circuits Assembly magazine, is voted on by customers and evaluates participants in the key areas of dependability, value, quality, responsiveness and technology. ECD won the Soldering Equipment category for the second year in a row, underscoring the effectiveness of the company’s M.O.L.E. thermal profiling systems and its robust service mindset.

January 10, 2017 – ECD has announced a series of upgrades and enhancements for its line of award-winning electronics manufacturing technologies, including new features for its SmartDRY™ Intelligent Dry Storage systems, M.O.L.E.® thermal profilers and OvenRIDER® NL2+ oven verification tool. All of these newly-upgraded products will be on display at the IPC APEX Expo in ECD booth #2139.

Dear ECD Partners and Customers: As a company that prides itself on fostering personal and professional growth, ECD is delighted that we are able to continue to offer our team development opportunities, while ensuring that you receive the highest level of support and expertise.    In light of this, we are writing to inform you that the following personnel changes have been implemented:

April 5, 2016 – At last month’s APEX event in Las Vegas, ECD was honored with one of the electronics assembly industry’s most prestigious awards, the Service Excellence Award. Unlike other contests that are voted on by a judging panel, the Service Excellence Award has particular cachet because winners are determined based on direct responses from participants’ customers, the true authorities of a company’s performance.

March 21, 2016 – Launched less than a year ago, ECD’s SmartDRY™ intelligent dry storage technology has dramatically changed the way manufacturers approach storage for moisture-sensitive devices (MSDs). With SmartDRY’s many unique features, electronics assembly specialists now have an affordable, sophisticated dry storage solution that is more conducive to dynamic manufacturing environments.

November 2015 – BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing and alternative energy markets, today announced that it has partnered with thermal measurement innovator ECD in a joint development initiative to integrate the company’s new Recipe Generator technology directly into BTU’s Wincon furnace operating system. ECD’s Recipe Generator is currently available through ECD’s M.O.L.E. series of thermal profiling systems, and the new integrated feature will be released in early 2016 as part of BTU’s Pyramax reflow product line. The technology will be the industry’s most comprehensive recipe prediction tool to-date, due to its process settings for zone temperatures and belt speed, which take into account the convection rate -- the most significant element of heat transfer.