ECD M.O.L.E.® Thermal Profiling - Press Release

April 6, 2020 – ECD today announced that Mike Hayward will lead the company’s operations in the EMEA region where he will oversee product sales, channel partnerships, customer technical support and strategic relationships. Hayward, who has an extensive technical background and has worked in the electronics industry for over 35 years, previously held a similar role with ECD and is delighted to re-join the company to help lead growth initiatives as the Director of EMEA Operations.

March 2, 2020–During last month’s IPC APEX EXPO electronics event, ECD was honored with two coveted Circuits Assembly Service Excellence Awards–one in the soldering category for its M.O.L.E.® thermal profiling technology and the other for MSD component storage powerhouse SmartDRY™. Unlike other industry competitions, the Service Excellence Award program is unique in that customers are the judges and their rankings across various criteria decide winner outcomes. Both product lines earned high marks from current customers in each of the five areas evaluated: dependability, quality, responsiveness, technology, and value for the price.

February 12, 2019 – Lauded for its simplicity, sleek design, unique feature set and unmatched recovery performance, ECD’s SmartDRY™ Intelligent Dry Storage system has further validated its market-leading status with top rankings from those who matter most – its customers. With its first-ever entry into Circuits Assembly magazine’s Service Excellence Awards program, SmartDRY™ locked up the component storage systems category with a decisive win, earning high marks from current customers in each of five critical areas: dependability, quality, responsiveness, technology, and value for the price.

October 30, 2018 – Thermal profiling leader ECD, designer and developer of M.O.L.E.® brand thermal measurement systems, today announced the release of its redesigned Temprobe™ non-destructive temperature sensing technology. The temperature measurement tool, used primarily for high-value assemblies where conventional thermocouples are not an option, has been re-engineered for increased robustness and longevity.

March 21, 2018 – At the upcoming NEPCON China event, set to take place April 24 – 26 in Shanghai, thermal process characterization and verification leader ECD debuts its brand new continuous monitoring technology, OvenSENTINEL™, to the Chinese electronics market. Also on display are its M.O.L.E.® and OvenRIDER® technologies; the premiere tools for high-reliability, high-yield thermal processing results. Exhibiting with local distributor WKK in booth # 1H30, ECD invites show delegates to learn more about OvenSENTINEL, the full line of M.O.L.E. profilers, the latest M.O.L.E. MAP software and the newly-designed OvenRIDER NL2+.

May 10, 2017 – ECD is recognized globally for its pioneering work in advanced thermal process measurement technologies. Central to the development of the company’s award-winning products are its knowledgeable people, many of whom lend their expertise to important industry initiatives. Such is the case with ECD’s Senior Project Engineer, Paul Austen, who was a member of and contributor to the standards committee that wrote the IPC-7530 “Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)”, IPC-7801 “Reflow Oven Process Control Standard”, and who also shared his expertise for the most recent revision of IPC-7530A, which was released this year. Paul, along with other committee members, was honored for his contributions at the annual awards luncheon hosted by the IPC at this year’s APEX event in San Diego, California.

April 19, 2017 – ECD is celebrating the company’s most successful year on record, as 2016 is now in the books and closed with significant financial and product development achievements. Strategic focus, a new product line, enhancements to existing technologies, award-winning service and a dedicated team are all cited as key contributors to the record-breaking result.

March 1, 2017 – ECD is celebrating its recent Service Excellence Award win, which marks the second consecutive such accolade for the thermal profiling and dry storage technology pioneer. The awards contest, sponsored by Circuits Assembly magazine, is voted on by customers and evaluates participants in the key areas of dependability, value, quality, responsiveness and technology. ECD won the Soldering Equipment category for the second year in a row, underscoring the effectiveness of the company’s M.O.L.E. thermal profiling systems and its robust service mindset.

January 10, 2017 – ECD has announced a series of upgrades and enhancements for its line of award-winning electronics manufacturing technologies, including new features for its SmartDRY™ Intelligent Dry Storage systems, M.O.L.E.® thermal profilers and OvenRIDER® NL2+ oven verification tool. All of these newly-upgraded products will be on display at the IPC APEX Expo in ECD booth #2139.

Dear ECD Partners and Customers: As a company that prides itself on fostering personal and professional growth, ECD is delighted that we are able to continue to offer our team development opportunities, while ensuring that you receive the highest level of support and expertise.    In light of this, we are writing to inform you that the following personnel changes have been implemented: