Thermal profiling is a recognized necessity for high-yield electronics assembly. As quality requirements dictate reflow process measurement, it is beneficial to understand which measurement and verification options are best for specific circumstances. One consideration is whether to profile the product (often referred to as the ‘golden board’) or the oven. This paper will present information that illustrates how oven profiling can be a more effective and beneficial approach versus that of product profiling. Parameters for successful implementation are also discussed.
Key Learning Points:
Click here to download
- A three-channel test vehicle can be used as a surrogate to represent a profile of a populated product.
- By using a surrogate test vehicle, you can save resources and improve product quality and repeatability.
- By profiling the oven instead of the product, tremendous production benefits are realized.