ECD’s award-winning M.O.L.E.® thermal profilers provide the most in-depth approach to yield-maximizing soldering operations: Definition of thermal process specifications is simplified with at-your-fingertips customizable templates and solder materials information; thermal profiles are measured thoroughly by tapping into as many as 20 channels of thermal data; and prediction and dynamic process visualization allow on-the-fly adaptability.
Define thermal process specifications
- A library of 600+ unique solder paste specifications
- Customizable KPI Templates with assignable limits
Measure the profile
- Up to 20 channels of thermal data
- Deep analytics with custom measures and calculations
Adapt to meet process needs
- Industry-leading prediction to bend the profile into specification
- Intuitive and dynamic process visualization
M.O.L.E. profilers in combination with the power of M.A.P. software let you dig deep and win big.
Digging deep doesn’t require deep pockets!
Call us (1-800-323-4548) to learn about our $1,200 trade-in credit on a new M.O.L.E.