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ECD Thermal Processing Expert Makes Contributions to IPC Standards

Posted on May 10, 2017

May 10, 2017 – ECD is recognized globally for its pioneering work in advanced thermal process measurement technologies. Central to the development of the company’s award-winning products are its knowledgeable people, many of whom lend their expertise to important industry initiatives. Such is the case with ECD’s Senior Project Engineer, Paul Austen, who was a member of and contributor to the standards committee that wrote the IPC-7530 “Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)”, IPC-7801 “Reflow Oven Process Control Standard”, and who also shared his expertise for the most recent revision of IPC-7530A, which was released this year. Paul, along with other committee members, was honored for his contributions at the annual awards luncheon hosted by the IPC at this year’s APEX event in San Diego, California.

ECD Thermal Profiling Expert - Paul Austen

Participating in the IPC’s standards initiatives over the years has been my honor...
-Paul Austen, Senior Project Engineer

ECD is passionate about quality and, specifically, setting standards that offer expert guidance for thermal profiling,” explains Austen, an influential member of the ECD team for 37 years. “Participating in the IPC’s standards initiatives over the years has been my honor, and all can benefit from collaboration with some of the industry’s most knowledgeable electronics professionals.

IPC is a global electronics industry trade association dedicated to furthering the competitive excellence and financial success of its members, who are participants in the electronics industry. Standards committee involvement is completely voluntary and without compensation, other than the immense satisfaction that comes from helping develop guidelines that foster quality electronics manufacturing and more reliable products. IPC’s standards are developed by committees made up of a wide cross-section of industry experts and manufactures well-versed in the specific technology subject. “Our goal is to produce the best standard and we are all careful to keep each other’s contributions free from bias,” shares Austen.

As with all things, advancement and improvements in technology are a requirement,” Austen says, noting the dynamic nature of the electronics industry. “While standards are developed to document a common practice, test method or language around a specific subject, it’s necessary to review the standards regularly, making revisions to keep up with the constant change in our industry. I’m very proud to have also been involved in the evolution of these standards.

In addition to his work with IPC, Paul Austen has authored several technical articles for industry publications and holds numerous patents. He has a Bachelor of Science degree in Electrical/Computer Engineering from the University of Portland, began working at ECD as an Electronics Test Technician and, for the past 35 years, has served as Senior Project Engineer. Austen has played a key role in the company’s development of signature technologies including the M.O.L.E.® thermal profiler, the M.O.L.E.’s many peripherals, and the SmartDRY™ Intelligent Dry Storage system for moisture sensitive devices (MSDs). He is based in the company’s Milwaukie, Oregon headquarters and can be reached via e-mail at


About ECD

Founded in 1964, ECD is recognized worldwide for its leadership and expertise in thermal monitoring and analysis technology and, more recently, for its development of intelligent dry storage systems. Based in Milwaukie, Oregon, the company is a pioneer in the design, development, and manufacture of advanced in-transit thermal profiling systems and software used to monitor and analyze process temperatures in various industries including electronics, solar and baking, among others. Well-known for its data-rich software expertise and robust hardware functionality, ECD leads the industry for innovative measurement and safeguarding systems. For more information on ECD and its products, visit | |

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