Most electronics professionals know it’s important for parts to be dry before sending them through the soldering process. There are, however, some common misconceptions about drying components and the best way to ensure moisture sensitive devices (MSDs) are ready for soldering.
The industry standard (IPC J-STD-033) that governs handling procedures and processes for MSDs can be difficult to apply. The goal of this paper is to provide clarity regarding MSD handling, confidence about J-STD-033 conformity, and explain how to avoid unnecessary baking and the manufacturing issues that can result from baking.
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