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Classic PCB Thermal Profiling of the Reflow Solder Process

Posted on May 01, 2011

Classic printed circuit board (PCB) profiling involves connecting thermocouples from your PCB assembly to a data recording profiling instrument and running the assembly through your reflow oven. Profiling has two primary objectives: 1) determining the correct process settings for a given PCB assembly and 2) verifying process consistency to ensure repeatable results. By viewing the actual temperatures (thermal profile) of a PCB while it travels through the reflow oven, once can verify and/or correct oven settings to achieve optimum quality for the finished product.

Classic thermal profiling of PCBs will ensure optimum consistent quality of finsihed PCB assemblies; substantially reduce PCB scrap rates; improve PCB production rates and yields; and improve overall profitability.

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