ECD M.O.L.E.® Thermal Profiling - Awards

March 1, 2017 – ECD is celebrating its recent Service Excellence Award win, which marks the second consecutive such accolade for the thermal profiling and dry storage technology pioneer. The awards contest, sponsored by Circuits Assembly magazine, is voted on by customers and evaluates participants in the key areas of dependability, value, quality, responsiveness and technology. ECD won the Soldering Equipment category for the second year in a row, underscoring the effectiveness of the company’s M.O.L.E. thermal profiling systems and its robust service mindset.

ECD’s unique Recipe Generator feature in the M.O.L.E.® MAP software suite helps electronics assembly specialists quickly and easily establish an initial in-spec reflow oven profile. Pre-populated drop-down menus make selecting reflow oven model and solder paste type simple. Component density and board thickness information is then entered with the aid of visual cues. Once these three parameters are defined, the recipe is generated – it’s that easy.

April 5, 2016 – At last month’s APEX event in Las Vegas, ECD was honored with one of the electronics assembly industry’s most prestigious awards, the Service Excellence Award. Unlike other contests that are voted on by a judging panel, the Service Excellence Award has particular cachet because winners are determined based on direct responses from participants’ customers, the true authorities of a company’s performance.