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Classic PCB Thermal Profiling of the Reflow Solder Process

Posted on May 01, 2011

Classic printed circuit board (PCB) profiling involves connecting thermocouples from your PCB assembly to a data recording profiling instrument and running the assembly through your reflow oven. Profiling has two primary objectives: 1) determining the correct process settings for a given PCB assembly and 2) verifying process consistency to ensure repeatable results. By viewing the actual temperatures (thermal profile) of a PCB while it travels through the reflow oven, once can verify and/or correct oven settings to achieve optimum quality for the finished product.

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Reflow Soldering – The Basics

Posted on May 20, 2010

Reflow soldering is a thermal process which is designed to melt a solder paste (a mixture of solder alloy powder with a solder flux to form a tacky paste) which has been placed on the exposed conductive pads of a circuit board and the contacts or leads of an electronic device to form a solder joint.

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How Important Is Thermal Profiling?

Posted on Sep 01, 2009

Thermal profiling is always necessary — no matter what. Or is it? If this sounds like a contradiction, there are currently ways of profiling that provide alternatives to the most time-consuming or labor-intensive methods. For example, oven verification may in some cases replace repeated board profiles, but only if strict parameters are met. The trick is in knowing when to profile the board or verify the oven performance.

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Oven vs. Board Profiling for the production environment

Posted on Jul 20, 2009

Thermal Profiling is a recognized necessity. As mid-to-high volume production continues to dominate in many areas, it is beneficial to understand the available choices in profiling, and which ones will work best under what circumstances. One of the main distinctions to be made is between board profiling and oven profiling. Having said that, it must be clear as to exactly when it is possible to effectively replace board profiling with oven profiling, the benefits of doing so, and the parameters that are required for successful implementation.

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ECD Introduces Newest Version of M.A.P.® Software

Posted on Oct 31, 2008

Milwaukie, OR, USA. October 31, 2008 – ECD, a leading provider of thermal profiling equipment and software, has again responded to the needs of the electronics assembly community; this time, by introducing a new and updated version (Version 2.16b) of its award-winning M.A.P.® software.

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Thermal profiling: A key element of process control

Posted on Sep 01, 2008

There is no doubt that in today’s more sophisticated electronics market, with boards populated with everything from BGAs to SiPs (System in Package), process control is more important than ever. At the center of achieving that control, you will find thermal management. And since thermal management cannot be achieved, or documented, without thermal profiling, thermal profiling brings us to the heart of the matter.

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ECD Introduces V-M.O.L.E.® Thermal Profiler At NEPCON South China

Posted on Aug 21, 2008

Milwaukie, OR, August 21, 2008 – ECD of Milwaukie, OR, has announced the NEPCON South China Shenzhen introduction of a new product in its line of thermal profiling products. Designed to complement both board profilers such as the twenty-channel MEGAM.O.L.E.®20 and the industry standard SuperM.O.L.E.® Gold, and oven profilers such as OvenRIDER®, and OvenWatch®, the V-M.O.L.E.® provides a fast, easy, and very affordable way to both verify and specify thermal profiles. Among thermal profilers, unique to the V-M.O.L.E.® and MEGAM.O.L.E.®20 is the ability for an engineer to pre-define the profile Go/No-Go criteria, while the production operator verifies with the push of a button.

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Improve Solder Scavenging of Large Area-array Sites

Posted on Aug 01, 2008

After BGA removal for repair, there typically is an excess of solder remaining on the board side, which can cause short circuits by bridging between adjacent joints and/or open circuits by preventing the complete collapse of all joints. It is imperative that the excess solder be removed to present a uniform surface across the site for proper component attachment, as BGA rework can be both time consuming and costly.

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