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Thermal profiling: A key element of process control

Posted on Sep 01, 2008

There is no doubt that in today’s more sophisticated electronics market, with boards populated with everything from BGAs to SiPs (System in Package), process control is more important than ever. At the center of achieving that control, you will find thermal management. And since thermal management cannot be achieved, or documented, without thermal profiling, thermal profiling brings us to the heart of the matter.

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ECD Introduces V-M.O.L.E.® Thermal Profiler At NEPCON South China

Posted on Aug 21, 2008

Milwaukie, OR, August 21, 2008 – ECD of Milwaukie, OR, has announced the NEPCON South China Shenzhen introduction of a new product in its line of thermal profiling products. Designed to complement both board profilers such as the twenty-channel MEGAM.O.L.E.®20 and the industry standard SuperM.O.L.E.® Gold, and oven profilers such as OvenRIDER®, and OvenWatch®, the V-M.O.L.E.® provides a fast, easy, and very affordable way to both verify and specify thermal profiles. Among thermal profilers, unique to the V-M.O.L.E.® and MEGAM.O.L.E.®20 is the ability for an engineer to pre-define the profile Go/No-Go criteria, while the production operator verifies with the push of a button.

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Improve Solder Scavenging of Large Area-array Sites

Posted on Aug 01, 2008

After BGA removal for repair, there typically is an excess of solder remaining on the board side, which can cause short circuits by bridging between adjacent joints and/or open circuits by preventing the complete collapse of all joints. It is imperative that the excess solder be removed to present a uniform surface across the site for proper component attachment, as BGA rework can be both time consuming and costly.

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Thermal profiling optimizes printed circuit board assembly

Posted on Apr 01, 2008

Thermal profiling is a critical function in printed circuit board assembly. This article describes thermal profiling hardware and process management software solutions as used at EMS provider Axiom Electronics LLC to meet the thermal profiling challenges of today’s microelectronics environment. Reflow challenges include thermal inequalities of high layer count circuit boards that have uneven mass distribution, components of varying sizes, micro BGAs, high ball-count BGAs, LGAs, etc. These easy to use thermal profiling tools help to improve yields by providing a stable repeatable process while saving time and providing necessary supporting documentation.

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ECD's MEGAM.O.L.E.® thermal profiler named winnner of ITC award

Posted on Mar 21, 2008

Milwaukie OR, March 15, 2008 – ECD’s MEGAM.O.L.E.®20 thermal profiler has been selected to receive an Innovative Technology Center (ITC) award at the IPC Printed Circuits Expo, APEX and the Designers Summit. The ITC showcases new and emerging technologies from all segments of the electronic interconnect industry. A formal IPC Review Board, consisting of a panel of industry experts, reviewed all company submissions and selected the winning products or services based on emerging technology or innovation.

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ECD releases new 20-channel profiler: data-rich, time-saving & easy to use

Posted on Nov 13, 2007

Milwaukie, OR, USA – November 13, 2007 – ECD of Milwaukie, Oregon, has just introduced a revolutionary thermal profiling system. Using only four “nano-connectors,” a design developed by, and unique to ECD, the MEGAM.O.L.E.® 20 Profiler offers a full twenty channels, the most of any traveling profiler in the reflow industry. At only 7.2 mm, MEGAM.O.L.E.® 20 provides a thinner and more advanced configuration than currently available, and has the capacity for over 25 runs before downloading data. This thin and narrow shape is especially beneficial when faced with significant physical constraints of nitrogen curtains, and when profiling smaller boards such as cell phones.

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Process Improvement Through Thermal Profiling

Posted on Jan 10, 2005

The goal of thermal profiling is to always increase quality and reduce waste. Three case histories - covering powder coating, baking and solder reflow applications - show you how three manufacturers achieved these goals.

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Reflow Oven Evaluation Using The ECD OvenRIDER

Posted on Mar 20, 2002

Characterization of the thermal performance of modern convection reflow ovens is important in ascertaining the process window for a particular product or application. This is especially true for lead free processes. Using typical manufacturing materials such as FR4 can be problematic in that the product changes thermal characteristics after a relatively short number of thermal excursions. Other potential test vehicles such as a stainless steel or aluminum plate are more robust and able to withstand repeated thermal cycles, however, introduce significantly different thermal conductivities that masks potential weaknesses in oven design. Trying to match these physical properties within a single test vehicle is necessary in order to characterize the various oven parameters. Such materials exist in composites with highly insulating properties similar to typical FR4 material as well as a high tolerance to numerous thermal excursions. This paper investigates the performance of three ...

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