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Dispelling Dry Storage Myths

Posted on May 07, 2019

Most electronics professionals know it’s important for parts to be dry before sending them through the soldering process. There are, however, some common misconceptions about drying components and the best way to ensure moisture sensitive devices (MSDs) are ready for soldering.

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Oven vs. Product Profiling

Posted on May 01, 2019

Thermal profiling is a recognized necessity for high-yield electronics assembly. As quality requirements dictate reflow process measurement, it is beneficial to understand which measurement and verification options are best for specific circumstances. One consideration is whether to profile the product (often referred to as the ‘golden board’) or the oven. This paper will present information that illustrates how oven profiling can be a more effective and beneficial approach versus that of product profiling. Parameters for successful implementation are also discussed.
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ECD’s SmartDRY™ MSD Storage Technology Earns High Marks from Customers, Lands Service Excellence Award

Posted on Feb 12, 2019

February 12, 2019 – Lauded for its simplicity, sleek design, unique feature set and unmatched recovery performance, ECD’s SmartDRY™ Intelligent Dry Storage system has further validated its market-leading status with top rankings from those who matter most – its customers. With its first-ever entry into Circuits Assembly magazine’s Service Excellence Awards program, SmartDRY™ locked up the component storage systems category with a decisive win, earning high marks from current customers in each of five critical areas: dependability, quality, responsiveness, technology, and value for the price.

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Heat Flow for Reflow

Posted on Jan 25, 2019

An often misunderstood concept in reflow soldering is heat flow and how it can influence the temperature of the product being heated. Controlling the reflow oven soldering process requires monitoring not only temperature but also heat flow. Since heat flow is what causes objects to increase in temperature, measuring your oven’s ability to increase the temperature of fixed thermal mass objects will allow you to detect variation in heat flow. By observing the temperature rise in the mass over a fixed amount of time, you can discover if the same amount of heat has been transferred into the mass. Such a measurement, combined with ambient temperature, yields a much more complete assessment of a reflow oven. Only by knowing the heat flow capacity of an oven can you be assured that the oven will heat your circuit boards at the same rate and to the same temperature, every time. This assures maximum yield and quality in the reflow process.

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ECD Redesigns Signature Temprobe™ for Improved Durability during High-Value PCB Process Characterization

Posted on Oct 31, 2018

October 30, 2018 – Thermal profiling leader ECD, designer and developer of M.O.L.E.® brand thermal measurement systems, today announced the release of its redesigned Temprobe™ non-destructive temperature sensing technology. The temperature measurement tool, used primarily for high-value assemblies where conventional thermocouples are not an option, has been re-engineered for increased robustness and longevity.

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We can help.

Posted on Oct 11, 2018

In today’s electronics manufacturing environment where small dimensions, assembly complexity and material performance variability are the norm, an in-control process can mean the difference between high yields or defects and profit or loss. Constant measurement, monitoring and verification are necessities if process success is the objective.

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Manufacturing is Tough, Dig Deep ……with M.O.L.E. Thermal Profilers

Posted on Sep 10, 2018

ECD’s award-winning M.O.L.E.® thermal profilers provide the most in-depth approach to yield-maximizing soldering operations: Definition of thermal process specifications is simplified with at-your-fingertips customizable templates and solder materials information; thermal profiles are measured thoroughly by tapping into as many as 20 channels of thermal data; and prediction and dynamic process visualization allow on-the-fly adaptability.

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Component Storage: Making Sense, Not Just Dollars

Posted on Aug 22, 2018

At ECD, our aim in designing a completely new technology for dry storage of moisture-sensitive devices (MSDs) was to give you more: more capability, more flexibility, more reliability and more profitability. The result is SmartDRY™ Intelligent Dry Storage, a complete paradigm shift in MSD storage systems that is delivering on the production line and the bottom line.

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Prediction makes Perfect

Posted on Aug 08, 2018

ECD develops and provides professional engineering tools to help you make better products - right from the start. When it comes to building high-reliability assemblies, having more information up front helps ensure higher yields.

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MSD Floor Life – Beware of “Studies”

Posted on Jul 25, 2018

As most assemblers know, once moisture sensitive devices (MSDs) are exposed to ambient conditions, the clock starts ticking on their floor life. Turning back time or resetting the floor life, so that parts are once again compliant with the latest J-STD-033D (just released in Q2 2018), is a function of effectively drying the parts. But beware the claims – so-called “studies” – about how this is achieved.

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