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Free Thermal Profiling Course

Posted on Mar 30, 2020

Now is the perfect time to take our Free Thermal Profiling Course. Equip yourself with knowledge and the right tools for efficiency and high-yield results.
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ECD’s Continued Support during COVID-19 Outbreak

Posted on Mar 20, 2020

On behalf of ECD, we extend our heartfelt concern to everyone impacted by COVID-19 – those with confirmed cases and their friends and family, those whose jobs and schools have been impacted, the medical personnel and first responders on the front lines, and so many more. As always, our top priority is the health and safety of our employees, customers and communities. We are diligently following guidance and best practices as outlined by the Center for Disease Control and Prevention (CDC).

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Customers Confirm ECD’s Technology Leadership and Service Excellence Across Product Lines

Posted on Mar 02, 2020

March 2, 2020–During last month’s IPC APEX EXPO electronics event, ECD was honored with two coveted Circuits Assembly Service Excellence Awards–one in the soldering category for its M.O.L.E.® thermal profiling technology and the other for MSD component storage powerhouse SmartDRY™. Unlike other industry competitions, the Service Excellence Award program is unique in that customers are the judges and their rankings across various criteria decide winner outcomes. Both product lines earned high marks from current customers in each of the five areas evaluated: dependability, quality, responsiveness, technology, and value for the price.
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How To Get The Best Thermal Profile

Posted on May 31, 2019

This paper provides an overview of thermocouple construction and function, as well as detail on how to size and spec the appropriate thermocouple for the application. Pros and cons of various thermocouple attachment methods are also presented.
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Dispelling Dry Storage Myths

Posted on May 07, 2019

Most electronics professionals know it’s important for parts to be dry before sending them through the soldering process. There are, however, some common misconceptions about drying components and the best way to ensure moisture sensitive devices (MSDs) are ready for soldering.

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Oven vs. Product Profiling

Posted on May 01, 2019

Thermal profiling is a recognized necessity for high-yield electronics assembly. As quality requirements dictate reflow process measurement, it is beneficial to understand which measurement and verification options are best for specific circumstances. One consideration is whether to profile the product (often referred to as the ‘golden board’) or the oven. This paper will present information that illustrates how oven profiling can be a more effective and beneficial approach versus that of product profiling. Parameters for successful implementation are also discussed.
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ECD’s SmartDRY™ MSD Storage Technology Earns High Marks from Customers, Lands Service Excellence Award

Posted on Feb 12, 2019

February 12, 2019 – Lauded for its simplicity, sleek design, unique feature set and unmatched recovery performance, ECD’s SmartDRY™ Intelligent Dry Storage system has further validated its market-leading status with top rankings from those who matter most – its customers. With its first-ever entry into Circuits Assembly magazine’s Service Excellence Awards program, SmartDRY™ locked up the component storage systems category with a decisive win, earning high marks from current customers in each of five critical areas: dependability, quality, responsiveness, technology, and value for the price.

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Heat Flow for Reflow

Posted on Jan 25, 2019

An often misunderstood concept in reflow soldering is heat flow and how it can influence the temperature of the product being heated. Controlling the reflow oven soldering process requires monitoring not only temperature but also heat flow. Since heat flow is what causes objects to increase in temperature, measuring your oven’s ability to increase the temperature of fixed thermal mass objects will allow you to detect variation in heat flow. By observing the temperature rise in the mass over a fixed amount of time, you can discover if the same amount of heat has been transferred into the mass. Such a measurement, combined with ambient temperature, yields a much more complete assessment of a reflow oven. Only by knowing the heat flow capacity of an oven can you be assured that the oven will heat your circuit boards at the same rate and to the same temperature, every time. This assures maximum yield and quality in the reflow process.

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ECD Redesigns Signature Temprobe™ for Improved Durability during High-Value PCB Process Characterization

Posted on Oct 31, 2018

October 30, 2018 – Thermal profiling leader ECD, designer and developer of M.O.L.E.® brand thermal measurement systems, today announced the release of its redesigned Temprobe™ non-destructive temperature sensing technology. The temperature measurement tool, used primarily for high-value assemblies where conventional thermocouples are not an option, has been re-engineered for increased robustness and longevity.

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