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SmartDRY is Ready. Are you?

Posted on May 31, 2017

Is your dry storage cabinet Industry 4.0 ready? If it’s SmartDRY™ it is. With fully integrated network capability, SmartDRY allows 24/7 access to important data about system performance and events.

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Difference-Makers

Posted on May 17, 2017

ECD’s M.O.L.E. thermal profiling and SmartDRY Intelligent Dry Storage technologies are having a positive impact on manufacturing operations around the world. But, it is our people that truly make the difference – in our product development, knowledgeable customer consultation and, importantly, contributions to making global electronics manufacturing the best it can be.

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ECD Thermal Processing Expert Makes Contributions to IPC Standards

Posted on May 10, 2017

May 10, 2017 – ECD is recognized globally for its pioneering work in advanced thermal process measurement technologies. Central to the development of the company’s award-winning products are its knowledgeable people, many of whom lend their expertise to important industry initiatives. Such is the case with ECD’s Senior Project Engineer, Paul Austen, who was a member of and contributor to the standards committee that wrote the IPC-7530 “Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)”, IPC-7801 “Reflow Oven Process Control Standard”, and who also shared his expertise for the most recent revision of IPC-7530A, which was released this year. Paul, along with other committee members, was honored for his contributions at the annual awards luncheon hosted by the IPC at this year’s APEX event in San Diego, California.

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Get Flux where You Want It!

Posted on May 01, 2017

Want to ensure PCB top side flux application is applied uniformly and in the proper pattern? ECD’s Fluxometer makes it easy. Periodically evaluating the consistency of flux deposition for the wave soldering process leads to optimized flux use, reduced rework and a better, more reliable end product.

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ECD Logs Record-Breaking Year, Attributes Impressive Results to Customer Loyalty, Product Innovation and Outstanding Service

Posted on Apr 19, 2017

April 19, 2017 – ECD is celebrating the company’s most successful year on record, as 2016 is now in the books and closed with significant financial and product development achievements. Strategic focus, a new product line, enhancements to existing technologies, award-winning service and a dedicated team are all cited as key contributors to the record-breaking result.

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Kill Step Productivity Leaps Forward

Posted on Apr 19, 2017

Kill Step Productivity is set to take a giant leap forward with the soon-to-be released BakeWATCH® Kill Step Calculator for Windows. This easy-to-use tool automates the data collection process and report generation in a single program, with no copy and paste required. It’s what you’ve been asking for, and definitely worth the wait!

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Is Baking MSDs Always a Necessity?

Posted on Mar 22, 2017

No, baking MSD parts isn’t required as normal protocol…even though many manufacturers have made baking part of standard MSD parts management. According to J-STD-033, baking is only required under specific conditions, which include MSL Level 6 parts and devices that have exceeded their floor life. Instead of baking just because that’s what’s always been done, learn more about the conditions under which MSDs should be baked and the detrimental effects of baking when you really shouldn’t.

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ECD Ranks Highest Among Soldering Equipment Providers, Honored with Second Consecutive Service Excellence Award

Posted on Mar 01, 2017

March 1, 2017 – ECD is celebrating its recent Service Excellence Award win, which marks the second consecutive such accolade for the thermal profiling and dry storage technology pioneer. The awards contest, sponsored by Circuits Assembly magazine, is voted on by customers and evaluates participants in the key areas of dependability, value, quality, responsiveness and technology. ECD won the Soldering Equipment category for the second year in a row, underscoring the effectiveness of the company’s M.O.L.E. thermal profiling systems and its robust service mindset.
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