After BGA removal for repair, there typically is an excess of solder remaining on the board side, which can cause short circuits by bridging between adjacent joints and/or open circuits by preventing the complete collapse of all joints. It is imperative that the excess solder be removed to present a uniform surface across the site for proper component attachment, as BGA rework can be both time consuming and costly.
Thermal profiling is a critical function in printed circuit board assembly. This article describes thermal profiling hardware and process management software solutions as used at EMS provider Axiom Electronics LLC to meet the thermal profiling challenges of today’s microelectronics environment. Reflow challenges include thermal inequalities of high layer count circuit boards that have uneven mass distribution, components of varying sizes, micro BGAs, high ball-count BGAs, LGAs, etc. These easy to use thermal profiling tools help to improve yields by providing a stable repeatable process while saving time and providing necessary supporting documentation.
Milwaukie OR, March 15, 2008 – ECD’s MEGAM.O.L.E.®20 thermal profiler has been selected to receive an Innovative Technology Center (ITC) award at the IPC Printed Circuits Expo, APEX and the Designers Summit. The ITC showcases new and emerging technologies from all segments of the electronic interconnect industry. A formal IPC Review Board, consisting of a panel of industry experts, reviewed all company submissions and selected the winning products or services based on emerging technology or innovation.
Milwaukie, OR, USA – November 13, 2007 – ECD of Milwaukie, Oregon, has just introduced a revolutionary thermal profiling system. Using only four “nano-connectors,” a design developed by, and unique to ECD, the MEGAM.O.L.E.® 20 Profiler offers a full twenty channels, the most of any traveling profiler in the reflow industry. At only 7.2 mm, MEGAM.O.L.E.® 20 provides a thinner and more advanced configuration than currently available, and has the capacity for over 25 runs before downloading data. This thin and narrow shape is especially beneficial when faced with significant physical constraints of nitrogen curtains, and when profiling smaller boards such as cell phones.
As the electronics industry prepares for the possibility of Pb-free Printed Circuit Board Assembly (PCBA) processing without the
The goal of thermal profiling is to always increase quality and reduce waste. Three case histories - covering powder coating, baking and solder reflow applications - show you how three manufacturers achieved these goals.
Characterization of the thermal performance of modern convection reflow ovens is important in
ascertaining the process window for a particular product or application. This is especially true
for lead free processes. Using typical manufacturing materials such as FR4 can be problematic
in that the product changes thermal characteristics after a relatively short number of thermal
excursions. Other potential test vehicles such as a stainless steel or aluminum plate are more
robust and able to withstand repeated thermal cycles, however, introduce significantly different
thermal conductivities that masks potential weaknesses in oven design. Trying to match these
physical properties within a single test vehicle is necessary in order to characterize the various
oven parameters. Such materials exist in composites with highly insulating properties similar to
typical FR4 material as well as a high tolerance to numerous thermal excursions. This paper
investigates the performance of three ...
With accurate monitoring of a reflow oven's operating parameters, SPC can track product quality and increase yields.