ECD website uses cookies to ensure you get the best experience on our website.

Heat Flow for Reflow

Controlling the reflow soldering process requires monitoring more than temperature. Heat flow can have a profound influence on the product’s thermal profile.

ECD Whitepaper - Heat flow for Reflow

  •  Heat flow AND ambient temperatures must be measured to truly access the effectiveness of the oven to heat.
  •  By observing the temperature rise in a known mass over a fixed amount of time, you can discover if the same amount of heat has been transferred into the mass.
  • There are effective tools that can measure both ambient and heat flow metrics.

We have additional white papers available in addition to more coming soon. If you’d like to be kept on our list for upcoming alerts, please complete the form to download the whitepaper on this page.

ECD Whitepaper - Oven vs Profiling

ECD Whitepaper - How To Get The Best Thermal Profile

Oven vs. Product Profiling How To Get The Best
Thermal Profile

ECD Whitepaper - Is Your Dry Storage J-Standard Compliant?

ECD Whitepaper - Dispelling Dry Storage Myths

Is Your Dry Storage
J-Standard Compliant?
Dispelling Dry Storage Myths
Please wait...
© ECD, 1996 - 2021. All rights reserved.