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ECD Thermosphere Collective IQ

The ECD Thermosphere Collective IQ is a collaboration of shared intelligence with Thermal Measurment as the primary focus.

 
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What is MAP?

Posted on Jan 04, 2016

MAP is an ECD-specific acronym for “Machine, Assembly, Process”.

  • Machine = Reflow Oven
  • Assembly = Printed Circuit Board
  • Process = The thermal “profile” specified by the Solder Paste manufacturer for proper reflow.

At ECD, we believe it our mission to help the Process Engineer to: “Optimize … Machine, Assembly and Process”, and so have named our new line of software to reflect that critical blending.

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