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ECD Thermosphere Collective IQ

The ECD Thermosphere Collective IQ is a collaboration of shared intelligence with Thermal Measurment as the primary focus.


ECD M.O.L.E.® Thermal Profiling - Cooling Slope

Term: Cooling Slope
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The Cooling Zone

Posted on Nov 18, 2010

A sometimes forgotten fact about reflow and wave soldering is that anywhere from 25% to 50% of the time a solder joint spends above its melting temperature, aka: time above liquidus (TAL), takes place in the "cooling zone". Much time is spent getting the heating portion of the oven recipe finely tuned to produce a robust thermal profile, only to toss the product, covered with liquefied solder into a cooling zone where the solder joints must return to a solid state. The rate at which this occurs (cooling slope) is even more critical using lead- free solders. Giving the cooling zone some well deserved attention when defining the requirements of the thermal profile is essential to a good Thermal Quality Management program for your soldering process.
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