- FEATURES
- SPECIFICATIONS
- EQUIPMENT
- IMAGES
| FEATURES |
Quality, Precision, Function
- Prevent PCB Damage
- Eliminate soldering or bonding of thermocouples to PCBs.
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Cut Labor Cost - Installation and removal take just seconds.
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Produce Reliable Profiles - High contact pressure and low thermal mass give fast, reliable response.
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Profile in Wet Solder Paste - Profile the first pass of a PCB through the oven.
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Monitor Temperature Anywhere - Small, durable thermocouple tip fits in tight places.
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| BENEFITS |
- Profile on the first pass through the oven by placing the Temprobe™ thermocouple tip in wet solder paste.
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Profiles are more accurate with Temprobe™ because no added material (solder or epoxy) is used for attachment.
- The Temprobe™ Thermocouple tip is preloaded to maintain high contact pressure throughout the profile.
- Temprobe™ makes it easy to take more profiles with greater reliability, to support ISO and SPC data requirements.
- Temprobe™ cuts labor, PCB rework and scrap to provide quick payback!
- No costly sacrificial test boards for temperature profiling.
- No soldering or bonding, so no residue or mechanical damage to the board assembly
- No need to rerun profiles because a taped down wire thermocouple lifted off the board.
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Compatibility: |
SuperM.O.L.E.® Gold, MEGAMOLE® and V-MOLE® |
Maximum reach radius: |
5.5 in (14 cm) Height with clamp: 0.55 to 0.49 in (14 to 12.5 mm) above PCB |
Probe Weight: |
14 grams (less cable & connector) |
Probe material: |
Stainless Steel |
Temperature limit: |
572° F (300° C) |
Sensor: |
Type K junction |
Lead wire: |
24 in. (60 cm) long, with Kapton® insulation |
Special Limits of Error: |
Less than ± 1.1° C (Per ANSI MC 96.1) |
| Temprobe™ for SMG |
Temprobe™ with Mini Connector |
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