|
| THE CRITICAL DATA YOU NEED... IN REAL-TIME, SOURCE DIRECT! |
INDATA™ enhancements extend the range of applications for thermal profiling beyond relatively small ovens of short process duration. Any conveyorized or batch process for which a thermal barrier can be designed that satisfies the time/temperature protection for the M.O.L.E. while retaining compatibility with workspace restrictions.
INDATA™ facilitates à la carte building of a SuperM.O.L.E.® Gold System. Choose a Profiler (with high-gain RF or without RF), Thermal Barrier and Thermocouples that combined, create a solution for your process (with no part substitutions needed). |
 |
|
|
- FEATURES
- SPECIFICATIONS
- EQUIPMENT
- IMAGES
- SOFTWARE
| FEATURES |
- Thermal Barriers employ active phase-change heatsinks for protection without bulk.
- Thermocouples add to the ECD range with inconel sheath, and magnetic & clamp-on styles.
- INDATA™ Temperature profiling Systems are designed to meet the tough demands for:
- Static and Conveyorized Ovens
- Furnaces
- Kilns
- Heat Treating
- Powder Coating
- Vacuum Casting
- Investment Casting
- Ferrous Founding
- Non-Ferrous Founding
- Ceramic Manufacturing
- Brick and Tile Manufacturing
- Glass Tempering
- Glass Bending
- Coating and Ink Curing
- Spring Annealing
- ..And More!
- Optional Wireless RF gear provides hi-gain +6 and +10db receiving antennas that ensure reception from large atmosphere & vacuum heat treating ovens, furnaces and kilns.
|
| Temperature measurement range: |
-200 to 2372°F (-129 to 1300°C) |
| Thermocouple: |
Six Micro, Type K & S |
| Accuracy: |
Within +/- 0.1 % + 1°C |
| Resolution: |
1°F (0.56°C), 0.1°F with MAP Software |
| Physical Dimensions: |
0.37 in. x 3.5 in. x 6 in. (9.41 mm x 89 mm x 152.4 mm) |
| Sampling Interval: |
.0.1 seconds to 24 hours |
| Number of samples: |
5460, with six channels active |
| Power Supply: |
Rechargeable Ni-MH Power Pack |
| INDATA™ Kit |
INDATA™ RF Option & 135 Barrier |
 |
 |
| SourceTRAK™ for Windows |
  |
| • Graphic and Intuitive User Interface, Modeling, Analysis, and Reporting application. |
| • Cure Index and Time Above Temperature analysis. |
| • Static or Conveyorized Furnace Modeling. |
| • Prediction: Alter furnace model parameters for comprehensive what-if analysis. |
|
|
|
![View Image - Glass set of 6 30-gauge [.010”/.254mm], 3ft (900F/482C)](/images/product/large/24_1_/24_1.jpg){kind=small}
![View Image - SSOB set of 6 24-gauge [.021”/0.53mm], 3ft (900F/482C)](/images/Product/large/69.jpg){kind=small}
![View Image - Glass Lead-Free Thermocouple Adapter Set [Miniature to Micro] (900F/482C)](/images/Product/large/25.jpg){kind=small}
