October 30, 2018 – Thermal profiling leader ECD, designer and developer of M.O.L.E.® brand thermal measurement systems, today announced the release of its redesigned Temprobe™ non-destructive temperature sensing technology. The temperature measurement tool, used primarily for high-value assemblies where conventional thermocouples are not an option, has been re-engineered for increased robustness and longevity.
“By nature, temperature sensing devices that are not mechanically attached to the PCB are delicate,” explains Mark Waterman, ECD M.O.L.E. Product Manager. “Their construction requires the use of materials that can accurately and repeatably measure temperature of key locations on the PCB without any tape or solder and that’s a challenging balance to strike. The new Temprobe design effectively unites durability and temperature sensitivity for repeatable, long-term use and highly accurate PCB temperature measurement.”
Temprobe’s redesign has dramatically improved its ruggedness, but hasn’t altered its exceptional process effectiveness for high-cost PCBs. When boards are so valuable that sacrificing one assembly for temperature measurement and characterization is out of the question, Temprobe is what manufacturers trust for proper profiling. The device can be quickly placed directly on the PCB and the miniaturized thermocouple tip is capable of precise temperature measurement of critical solder joints and components – even in wet solder paste or on fine-pitch component leads.
Compatible with all M.O.L.E. and competitive thermal profilers, Temprobe is ideal for PCBs built for military, aerospace, sonar, radar, computing and some medical applications where assembly value is high and margin for error is nonexistent. With the new design, Temprobe’s ROI is greater than ever before.
For more information about the re-engineered Temprobe or any of ECD’s award-winning products, visit www.ecd.com.
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Founded in 1964, ECD is recognized worldwide for its leadership and expertise in thermal monitoring and analysis technology and, more recently, for its development of intelligent dry storage systems. Based in Milwaukie, Oregon, the company is a pioneer in the design, development, and manufacture of advanced in-transit thermal profiling systems and software used to monitor and analyze process temperatures in various industries including electronics, solar and baking, among others. Well-known for its data-rich software expertise and robust hardware functionality, ECD leads the industry for innovative measurement and safeguarding
systems. For more information on ECD and its products, visit www.bakewatch.com -- www.ecd.com -- www.smartdry.com.
President and CEO, ECD
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