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Oven vs. Board Profiling for the production environment

Posted on Jul 20, 2009

Thermal Profiling is a recognized necessity. As mid-to-high volume production continues to dominate in many areas, it is beneficial to understand the available choices in profiling, and which ones will work best under what circumstances. One of the main distinctions to be made is between board profiling and oven profiling. Having said that, it must be clear as to exactly when it is possible to effectively replace board profiling with oven profiling, the benefits of doing so, and the parameters that are required for successful implementation.

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ECD Introduces Newest Version of M.A.P.® Software

Posted on Oct 31, 2008

Milwaukie, OR, USA. October 31, 2008 – ECD, a leading provider of thermal profiling equipment and software, has again responded to the needs of the electronics assembly community; this time, by introducing a new and updated version (Version 2.16b) of its award-winning M.A.P.® software.

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Thermal profiling: A key element of process control

Posted on Sep 01, 2008

There is no doubt that in today’s more sophisticated electronics market, with boards populated with everything from BGAs to SiPs (System in Package), process control is more important than ever. At the center of achieving that control, you will find thermal management. And since thermal management cannot be achieved, or documented, without thermal profiling, thermal profiling brings us to the heart of the matter.

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ECD Introduces V-M.O.L.E.® Thermal Profiler At NEPCON South China

Posted on Aug 21, 2008

Milwaukie, OR, August 21, 2008 – ECD of Milwaukie, OR, has announced the NEPCON South China Shenzhen introduction of a new product in its line of thermal profiling products. Designed to complement both board profilers such as the twenty-channel MEGAM.O.L.E.®20 and the industry standard SuperM.O.L.E.® Gold, and oven profilers such as OvenRIDER®, and OvenWatch®, the V-M.O.L.E.® provides a fast, easy, and very affordable way to both verify and specify thermal profiles. Among thermal profilers, unique to the V-M.O.L.E.® and MEGAM.O.L.E.®20 is the ability for an engineer to pre-define the profile Go/No-Go criteria, while the production operator verifies with the push of a button.

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Improve Solder Scavenging of Large Area-array Sites

Posted on Aug 01, 2008

After BGA removal for repair, there typically is an excess of solder remaining on the board side, which can cause short circuits by bridging between adjacent joints and/or open circuits by preventing the complete collapse of all joints. It is imperative that the excess solder be removed to present a uniform surface across the site for proper component attachment, as BGA rework can be both time consuming and costly.

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Thermal profiling optimizes printed circuit board assembly

Posted on Apr 01, 2008

Thermal profiling is a critical function in printed circuit board assembly. This article describes thermal profiling hardware and process management software solutions as used at EMS provider Axiom Electronics LLC to meet the thermal profiling challenges of today’s microelectronics environment. Reflow challenges include thermal inequalities of high layer count circuit boards that have uneven mass distribution, components of varying sizes, micro BGAs, high ball-count BGAs, LGAs, etc. These easy to use thermal profiling tools help to improve yields by providing a stable repeatable process while saving time and providing necessary supporting documentation.

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ECD's MEGAM.O.L.E.® thermal profiler named winnner of ITC award

Posted on Mar 21, 2008

Milwaukie OR, March 15, 2008 – ECD’s MEGAM.O.L.E.®20 thermal profiler has been selected to receive an Innovative Technology Center (ITC) award at the IPC Printed Circuits Expo, APEX and the Designers Summit. The ITC showcases new and emerging technologies from all segments of the electronic interconnect industry. A formal IPC Review Board, consisting of a panel of industry experts, reviewed all company submissions and selected the winning products or services based on emerging technology or innovation.

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ECD releases new 20-channel profiler: data-rich, time-saving & easy to use

Posted on Nov 13, 2007

Milwaukie, OR, USA – November 13, 2007 – ECD of Milwaukie, Oregon, has just introduced a revolutionary thermal profiling system. Using only four “nano-connectors,” a design developed by, and unique to ECD, the MEGAM.O.L.E.® 20 Profiler offers a full twenty channels, the most of any traveling profiler in the reflow industry. At only 7.2 mm, MEGAM.O.L.E.® 20 provides a thinner and more advanced configuration than currently available, and has the capacity for over 25 runs before downloading data. This thin and narrow shape is especially beneficial when faced with significant physical constraints of nitrogen curtains, and when profiling smaller boards such as cell phones.

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