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ECD Thermal Processing Expert Makes Contributions to IPC Standards

Posted on May 10, 2017

May 10, 2017 – ECD is recognized globally for its pioneering work in advanced thermal process measurement technologies. Central to the development of the company’s award-winning products are its knowledgeable people, many of whom lend their expertise to important industry initiatives. Such is the case with ECD’s Senior Project Engineer, Paul Austen, who was a member of and contributor to the standards committee that wrote the IPC-7530 “Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)”, IPC-7801 “Reflow Oven Process Control Standard”, and who also shared his expertise for the most recent revision of IPC-7530A, which was released this year. Paul, along with other committee members, was honored for his contributions at the annual awards luncheon hosted by the IPC at this year’s APEX event in San Diego, California.

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Get Flux where You Want It!

Posted on May 01, 2017

Want to ensure PCB top side flux application is applied uniformly and in the proper pattern? ECD’s Fluxometer makes it easy. Periodically evaluating the consistency of flux deposition for the wave soldering process leads to optimized flux use, reduced rework and a better, more reliable end product.

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ECD Logs Record-Breaking Year, Attributes Impressive Results to Customer Loyalty, Product Innovation and Outstanding Service

Posted on Apr 19, 2017

April 19, 2017 – ECD is celebrating the company’s most successful year on record, as 2016 is now in the books and closed with significant financial and product development achievements. Strategic focus, a new product line, enhancements to existing technologies, award-winning service and a dedicated team are all cited as key contributors to the record-breaking result.

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Is Baking MSDs Always a Necessity?

Posted on Mar 22, 2017

No, baking MSD parts isn’t required as normal protocol…even though many manufacturers have made baking part of standard MSD parts management. According to J-STD-033, baking is only required under specific conditions, which include MSL Level 6 parts and devices that have exceeded their floor life. Instead of baking just because that’s what’s always been done, learn more about the conditions under which MSDs should be baked and the detrimental effects of baking when you really shouldn’t.

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ECD Ranks Highest Among Soldering Equipment Providers, Honored with Second Consecutive Service Excellence Award

Posted on Mar 01, 2017

March 1, 2017 – ECD is celebrating its recent Service Excellence Award win, which marks the second consecutive such accolade for the thermal profiling and dry storage technology pioneer. The awards contest, sponsored by Circuits Assembly magazine, is voted on by customers and evaluates participants in the key areas of dependability, value, quality, responsiveness and technology. ECD won the Soldering Equipment category for the second year in a row, underscoring the effectiveness of the company’s M.O.L.E. thermal profiling systems and its robust service mindset.
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SmartDRY goes to San Diego

Posted on Feb 08, 2017

The market's most intelligent dry storage technology will be on show at next week’s IPC APEX Expo in San Diego, California. Don’t miss your opportunity to find out what SmartDRY can do for your MSD parts storage procedures: from integrated networking capability, to super-fast recovery to exceptional built in the USA quality, SmartDRY is the benchmark for sophisticated and affordable dry cabinet technology.

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Start the year off right with SmartDRY Intelligent Dry Storage

Posted on Jan 12, 2017

There’s no time like the present to get your MSD storage house in order – and we mean in order! With brand new fixed and pull-out shelving options for the SmartDRY portfolio, staying organized is easy. But, this is just a very small part of the huge advantages SmartDRY delivers. Check these out and then put acquiring SmartDRY on the top of your “to do” list for 2017:

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ECD Product Line Enhancements Underscore Continuous Improvement Philosophy

Posted on Jan 11, 2017

January 10, 2017 – ECD has announced a series of upgrades and enhancements for its line of award-winning electronics manufacturing technologies, including new features for its SmartDRY™ Intelligent Dry Storage systems, M.O.L.E.® thermal profilers and OvenRIDER® NL2+ oven verification tool. All of these newly-upgraded products will be on display at the IPC APEX Expo in ECD booth #2139.

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Give the gift of M.O.L.E.®

Posted on Dec 06, 2016

In the spirit of the season, ECD is extending a generous offer to ensure your favorite production elves have the latest technology for a profitable New Year!

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We’ll Do the Heavy Lifting

Posted on Nov 10, 2016

With ECD’s portfolio of carriers designed for various thermal processes, you can rest assured your thermal profiler will be safely transported and protected. From reflow to wave and V-M.O.L.E®s to SuperM.O.L.E.® Gold 2s to PCBs, ECD’s carrier systems ensure proper safeguarding of valuable thermal data.

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