Time and temperature are very important variables in soldering printed circuit boards. It is important to bring the circuit board assemblies up to a high enough temperature for a long enough period to effectively solder the components to the board. Getting the temperature up too high or heating the assembly too quickly can result in component damage. Not heating things up enough results in poor soldering and reliability problems.

Benefits of Baking Profiling Improves product consistency, minimizes waste, reduces energy consumption and cost, facilitates process reproducibility, enables minimization of ingredients, and increases line profitability. As enzymes continue to evolve, extending shelf life and enhancing the baker's ability to achieve market driven demand for low-carb goods, profiling allows the baker to achieve highest quality results in an increasingly demanding baking environment.

Staying ahead of the competition in the solar industry can be just a few tenths of a percentage increase in efficiency. Time temperature profiling at the wafer can significantly increase your understanding of critical process parameters that directly impact cell efficiency; Temperature Ramp Rate, Hold Time (Dry Time), Time above Temperature, Peak Temperature and cooling rates. ECD’s V-M.O.L.E.® Solar Profiling System is designed to provide assurance that these key process parameter are met quicker and easier than any other profiler on the market.

INDATA™ from ECD employs the newest, most accurate technology for Source Direct Profiling™ of ovens and furnaces. Designed specifically for industrial applications, the INDATA™ Profiling System offers unparalleled data collection with real-time delivery options, eliminating any guesswork and assuring quality while minimizing waste. As the fastest, most powerful profiling tool in the industry, the fully programmable INDATA™ system saves time, is easy to use and offers the most sophisticated reporting and analysis of your processes.