http://www.circuitnet.com/articles/article_83073.shtml as a response to an Ask the Expert Question. We think it’s worth repeating here as well.

Subj: Unusual Component Lead Contamination

We suspect the issue visible on the attached image is due to contamination on this component lead. We only see this issue on one component type, and only on one side of the component.

Can you offer any comments? E.W.

REPLY FROM PAUL AUSTEN, OF ECD:

Here is one possible cause to check on before you apply the failure to the component.

As with most solder quality problems, it is best to make sure the solder thermal profile, as required for good soldering for you specific solder paste, is being met. Do not assume that a general thermal profile for this board is the same everywhere on the board.

Make sure the thermal profile on or very near each end of this component is as needed. I have heard of components as small as this stand up on one end and then lay back down again during the solder transition into the liquid state (AKA: liquidous, or liquidus) because one end of the part heated faster than the other by a few fractions of a second. By the time the component lays down again, it is too late for best wetting.

To look for this possible time delay in the heating of the component’s ends with your thermal profiling software, make sure the profile peak alignment tool in the profiling software is turned off so you can see instant by instant the temperatures measured at each end of the part through the liquidous point of the solder. If one end is hotter than the other during this time, this may be part of the problem.

The cause of the temperature difference may be because one end of the part was on a pad that had no (or poor) thermal relief compared to the other. Typically, you need both pads of a component to be thermally equivalent. It may be that the board design needs to changed, or it may be as simple as running the board through the oven process turned 90 or 180 degrees to the current orientation.

However, turning the board 90 to 180 degrees may introduce other production or thermal issues on other components. None the less it may be worth trying.

Paul Austen, Senior Project Engineer

Electronic Controls Design Inc

paul.austen@ecd.com

Paul Austen is a 30 year veteran Senior Project Engineer with ECD in Milwaukie, Oregon. Paul has seen and worked with the electronic manufacturing industry from many points of view, including: technician, designer, manufacture, and customer.

The cooling zone is where the quality of the solder joint is defined, with the cooling slope influencing the joint strength, and overall longevity. These two qualities are often at odds with each other because strength often comes from slower cooling rates, while longevity results from faster rates. Different cooling slopes have been tested to try to find what rate produces the best combination of strength and long life when subjected to accelerated thermal-cycling. These studies have concluded that slow cooling rates (1 to 2 °C/sec) allow too much time for intermetallic alloy growth, a strong but often brittle alloy prone to cracking when stressed. Faster cooling (5 to 7 ºC/sec) can form a softer solder joint with less overall strength, not to mention possible component damage. Cooling slopes between 3 and 4 °C/sec were found to be the best at producing a solder joint with both good strength and overall longevity.

So… don’t forget the cooling zone when developing the best thermal profile for your solder process.

References:

“Cooling Rates in Lead-free and Tin/lead Reflow”
SMT Magazine

by Denis Barbini, PhD.; Ursula Marquez

“Accelerated Thermal Fatigue of Lead-Free Solder Joints as a Function of Reflow Cooling Rate” Journal of Electronic Materials

by Qi Y; Zbrzezny A R; Agia M; Lam R; Et al

“Proceedings of 2005 International Conference on…” Asian Green Electronics
by Qiang Hu; Zhong-suo Lee; Zhi-li Zhao; Da-le Lee

1. (Max preheat) How hot the board is just before it hits the wave
2. (Dwell time) how long do you spend in the wave
3. (Contact temp) Temperature of the solder at the contact surface with the board
4. Conveyor speed

All the rest of the many measurable parameters are secondary to these in my opinion. Let’s talk a little about each of these as measured by the WaveRIDER SPC software:

Figure 1: WaveRIDER SPC Software

Max Preheat temp (Preheat Max Temp) is really the temperature of the board (solder joints) just before it hits the wave so you can understand the “shock” the solder joint will get when contact with the wave forces it to melt the solder in a quick few seconds. This temp may NOT be the max preheat temp applied because most wave machines have a large gap between the pre-heater and the solder wave so the board will loose some of the heat during that space/time.

The Dwell time is how long the solder will be above liquidous, all said and done, and this time needs to be consistent across the width of the wave (AKA: parallelism), but you can see consistency across the wave just as easy by setting a min/max spec for the three dwell times. How long you must dwell is a function your solder joint requirements and components ability to withstand the wave temp. Most component specs say they can take 10 seconds or less and most solder joints need only a second to form. The longer you spend above liquidous the more time you give to form the brittle “intermetallic” alloy between the not molten metals. So the only reason you dwell at all is to get the heat to travel up the lead to the board top (on through-hole parts), which may take a few seconds depending on the thermal conductivity of the board and its thickness. A pot of liquid solder has plenty of heat to force into a board, so it depends mostly on the thermal conductivity of the board material itself. You will have to watch/trial your assembly (board) to see just how long that takes so you can set a minimum dwell time. The Dwell time is usually about 2.5 seconds for most 0.062″ (1.6mm) thick boards and this can vary +/- 10% to 15%.

Figure 2: Wave crest pattern

Pot temp at the solder contact surface (Contact temp) does vary depending on the load (your board) places on the surface of the solder wave. It is not the same as the solder pot temp, since that temp is controlled by a Thermocouple deep in the core of the solder pot and not the surface where the board skims across. This temperature should be maintained at least 20ºC or more above liquidous and no more then the maximum temperature allowed by the component specifications.

The conveyor speed is measured by dividing 9.75″ (distance between C and Speed sensors on the WaveRIDER pallet, see Figure 4) by the time measured between the C and Speed sensors hitting the main wave. It is easy to see why this is an important measure since ALL other values will be altered if the conveyor speed changes. Most solder machines can maintain speeds within +/-0.1 ft/minute (+/-1.2 in/minute, +/-3cm/minute)

Immersion depth is only important to prevent solder from spilling over the top of the board during wave contact. The absolute setting is not critical provided it is NOT spilling over the board and its depth is affording the dwell time one needs. However, it is easier to adjust the conveyor speed to control dwell time then the board’s immersion depth and risk a spill over. This is usually controlled by pump RPMs and how full the pot is of solder. If these change over time, the dwell times slowly change and thus is be one of the reasons for dwell changes. However, neither can be directly measured by WaveRIDER which has no chance to access the pump’s RPMs or the amount of solder in the pot.

Conclusion:
Focus your efforts on the critical WaverRIDER measurements by setting reasonable specifications. The many other things the WaveRIDER measures are not as critical, and can be used to diagnose a problem if there is one rather then used to prove there is NO problem. Use the WaveRIDER SPC software to set Spec limits and plot X-Bar R charts for these critical parameters. (Figure 3)

Figure 3: X-Bar R charts

Figure 4: Keep the WaveRIDER pallet contacts clean using a fine wire brush. This will reduce oxide build up on the sensors which can cause the Dwell times vary beyond normal.

High temperature solder is probably the most stable method of attachment

What are some advantages of Hi Temperature Solder?

Stable – long term with proper metal surfaces
Accurate – Can be attached to very small components

What are some of the disadvantages of Hi Temperature Solder.

Does not stick to many materials
May affect solder joint alloy composition
Expensive
Soldering skill required

You can buy high-temp solder here