Archive for category Thermal Profiler
MOLE® Thermal Profiler Calibration – Why and When?
Posted by Paul Austen in Thermal Musings, Thermal Profiler, Thermal Profiling on July 26th, 2010
MOLE® Thermal Profiler Calibration – Why and When?
Calibration of electronic measurement instruments is a necessary process, even though most electronic equipment is very stable and somewhat “resistant” to the effects of environment and changes due to aging.
Q: So why calibrate if my MOLE is “in spec” every time I send it in for calibration?
Because calibration is not so much an adjustment process but rather a proofing process that shows, over time, that your MOLE has been in calibration and thus should remain in calibration, because you have a track record to prove it. Documented history of a MOLE’s performance is the only way to claim your MOLE is in calibration at any given instant.
Most good labs will tell you that when your MOLE is calibrated, it is compared to standards , typically standards that have traceability to NIST, and if it is shown to be measuring within its specified accuracy they will not make any attempt to “adjust” it. Only if it is “on the edge,” which usually means it is getting to the last 10% to 20% of the specified accuracy limit, will they make any adjustments. Your MOLE may still be “in spec” and thus “in calibration,” when the lab received it, but getting close, so they will adjust it closer to the middle of the spec. range.
If it is out-of-spec when received by the lab, then a red flag goes up and calls into question every measurement made since the last calibration! The lab will tell you how far out of spec it is, and you can decide if its measurements during that time affect the quality of the measurements made more than can be tolerated, or if they are “close enough” to still be acceptable.
Q: So, when should the MOLE be calibrated?
The number one best time to calibrate the MOLE is on a regular time-based interval, which is recommended once a year. However, there are other events which may cause you to want to seek calibration at other times of the year, such as:
- When the MOLE is subjected to rough treatment like a fall to the floor,
- When your MOLE is accidently “over heated” ,
- When you are starting a new product introduction and you are characterizing an oven and new assembly to find the right recipe,
- When a new customer’s contract stipulates you use equipment that has been recently calibrated,
- When your in-house quality program requires a calibration interval.
Getting your MOLE calibrated is easy and we want to make sure you are always making the highest quality temperature measurements.
The Fastest Way to Know Your profile is “OK”
Posted by Paul Austen in Extracting Parameters, M.O.L.E. MAP, Reading Profiles, Reflow Profiling, Thermal Profiler, Thermal Profiling on February 25th, 2010
Now there is a way to verify that your profile requirements are being met in less time than you ever thought possible. The letters in the name M.O.L.E.® thermal profiler have always stood for Multi-channel Occurrent Logger Evaluator. Now the patented* “OK button” feature truly makes “E” in MOLE a reality, because now the MOLE profiler can automatically compare the measured temperature profile to your pre-programmed profile requirements.
The ECD V-MOLE with patented one button “OK” profile evaluation
(The OK Button is also available on the 20-channel MEGAM.O.L.E.™ thermal profiler, and OvenCHECKER™ )
Taking only seconds, the MOLE can tell you and your oven operators if the profile just measured is in or out of specification with the universally understood Green for good (GO!) or Red for bad (STOP!).
You get to set the specification limits for any or all of the four most popular profile parameters:
- Ramp Slope
- Time Between temperatures
- Time above Liquidous
- Peak Temperature
…and you can choose which of the MOLE’s input channels to include, up to 20 channels on the MEGAM.O.L.E.™, and three on the V-M.O.L.E.™ thermal profilers.
The Specification Table in MAP Software
Using the MAP™ Profiling software, enter your specification limits for the four profile parameters in the Upper and Lower Limits table in the “Target-10 OK” tab. These values will automatically be sent to the MOLE profiler when you use the Verify Process Wizard to confirm that a previously characterized oven recipe is still performing within specification.
MAP™ Profiling Software Target-10 OK Profile tab
Once programmed, the MOLE profiler can be used many times (up to 96 times) to Verify your oven is producing the same profile, without reconnecting to your computer. Simply run the profile and press the “OK Button” on the MOLE. No more running back to the PC software to download to see the results. One push of the OK button, and you get your answer…Go, or No-Go. It’s that simple!
*U.S. Patent Number 7653502.
Thermal Profiling in the Solar Industry
Posted by Rex Breunsbach in Solar Cell Manufacturing, Thermal Profiler on August 7th, 2009
Reach For the Sun
Solar Cell manufacturing has been around for a long time; however the materials and process have changed drastically in the past few years and will continue to evolve as the technology and need for Renewable Energy grows. The costs of manufacturing and the risks associated with the ever changing processes can strain the ability to maintain yields and improve quality. Proving these new manufacturing processes, then achieving the repeatability and yield needed for production have always been a challenge.
ECD’s suite of profiling tools allow detailed Characterization of these advanced processes during the R&D phase. During production ramp-up good thermal thermal profile data drives yield improvement leading to maximum profitability. In production these same tools can quickly Verify that the optimum manufacturing process is being maintained.
Thin Film Solar
ECD has many types of customers in the Solar Cell manufacturing industry. They include start-ups, university research departments and production facilities, located around the globe.
The application areas that we have been able to identify are among the following:
Silicon Metallization:
Thermal profiling is used to optimize the drying, rapid firing and following cooling process in the oven.
Silicon Diffusion:
Thermal profiling is used to optimize the heating, high temperature diffusion and cooling process in the oven.
Thin film Solar Cells:
Done on glass and other substrates, this process is similar to Diffusion process, but at lower temperature.
Profiling Equipment Requirements:
Minimum profiler thickness is important – Many of the ovens designed for solar manufacturing provide little vertical clearance for the profilers. Thermal barrier requirements vary and in some cases, time and temperature do not allow pass-thru profiling. In most cases 3 channels of thermal data are sufficient for process verification as all areas of the silicon heat similarly. Thermocouple attachment can also be tedious, with mechanical pressure being the most common contact method.
We look forward to the continued growth and success of the Solar industry and we would like to invite all solar industry participants to work with us and discover how we can help you reach your performance goals.
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