Good solder joints are not enough. A good reflow profile must consider component temperature limitations.
The new IPC standard released Dec 08, Classification of Non-IC Electronic Components for Assembly Processes, J-STD-075, calls for thermal classification of components, and recommends a marking system to help contract manufactures recognize component temperature limits during the soldering process. Failures don’t show up during initial test, but much later on in the product’s life – often six months to two years later, and well below forecasts that drive pricing and warranty policies. ALL parts have temperature limits; and until we take the time to profile the process to which we subject these parts, we can’t know if we cause harm or not.
ECD has moved in that direction with our Thermal Quality Management (ThQM™) Program. We think this will give the industry the knowledge and tools to look at ALL components in the comprehensive light necessary. Equally important, it introduces a program and method of dialog between OEM and EMS provider on soldering process issues.
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