Archive for March, 2009
Thermally Sensitive Components and J-STD-075
Posted by Rex Breunsbach in Profiling, Reflow Profiling on March 26th, 2009

Good solder joints are not enough. A good reflow profile must consider component temperature limitations.
The new IPC standard released Dec 08, Classification of Non-IC Electronic Components for Assembly Processes, J-STD-075, calls for thermal classification of components, and recommends a marking system to help contract manufactures recognize component temperature limits during the soldering process. Failures don’t show up during initial test, but much later on in the product’s life – often six months to two years later, and well below forecasts that drive pricing and warranty policies. ALL parts have temperature limits; and until we take the time to profile the process to which we subject these parts, we can’t know if we cause harm or not.
ECD has moved in that direction with our Thermal Quality Management (ThQM™) Program. We think this will give the industry the knowledge and tools to look at ALL components in the comprehensive light necessary. Equally important, it introduces a program and method of dialog between OEM and EMS provider on soldering process issues.
Thermocouple Size or Gauge
Posted by Rex Breunsbach in Size or Gauge, Thermocouples on March 18th, 2009
There is more than one way to specify thermocouple size.
Thermocouples are made when two conductors (wires) of different metals (alloys) are connected together to form a “junction.” This junction, or connection between the two conductors, is typically made by melting the two conductors together using a torch or a flash welding process. The size of the thermocouple is typically specified by the size of the two conductors, however, rather then the size of the junction formed where the conductors are melted together. The junction size is typically 2.5 time the wire diameter or less. Since the junction can vary somewhat, it is not the best way to specify the thermocouple size. So we us the wire size. Below are several of the most common ways to specify the size of a thermocouple:
- Gauge (American Wire Gauge, or AWG)
Wire gauge is common in the US and has meaning in the electronic and electrical fields. It’s handy because it keeps you from having to say (or write) long decimal numbers like 0.005 inches in diameter when you can just say 36 gauge. However, it’s upside-down in that as gauge number goes up, wire diameter goes down. There is a ratio between the gauge size and the diameter in inches:
Wire Diameter (inches) = 0.005 * (92^((36-AWG)/39))
As messy as this is, we still use AWG to call out thermocouple wire size. Here is a table of some common wire gauge sizes and their diameters in inches:
AWG Diameter (inches)
22 0.0253
24 0.0201
26 0.0159
28 0.0126
30 0.0100
32 0.008
34 0.0063
36 0.005
38 0.004
40 0.0031
- Wire diameter
We also size thermocouple wire by the diameter of the conductors. Each of the two conductors will be the same diameter, of course. See the above table for typical conductor conductor diameters use in the US.
- Square Millimeters (mm²)
Most other countries in the world use what’s called cross sectional area to specify the wire size. This is nothing more then the area of the circle formed by the conductor if you were to look flat at the end of the conductor. You know the area of a circle is:
Area =∏*radius²
And since the rest of the world is metric, this area is in millimeters (mm²). Common wire sizes are in nice round mm² numbers which means common sizes do not match up well with the AWG sizes. The table below shows the mm² sizes for the AWG gauge sizes:
AWG mm²
22 0.326
24 0.205
26 0.129
28 0.081
30 0.051
32 0.032
34 0.020
36 0.013
38 0.008
40 0.005
The most common thermocouple wire gauge sizes used for reflow or wave soldering in the US are: 30 and 36 AWG, and some 40 AWG
A common size in other countries is 0.03 mm², which as you can see from the table above is neither 30 nor 36, but real close to 32 AWG. The method used to specify a thermocouple size really depends on where (what country) you are buying it from. Although we can all convert, and most make equivalent sizes, what you will hear on the street will be AWG size in the US and area in millimeters most anywhere else in the world.
“Wavy” Reflow Profiles
Posted by Paul Austen in Profiling, Reflow Profiling on March 17th, 2009

Profile temperature measurements that cycle up and down
Why are some profiles more wavy than others?
Wavy looking profiles may be caused by something not always expected. In this case we were reflow soldering a very large and thick board; a back plane board that was 14 inches wide and 30 inches long and over 0.25 inches thick. One would expect that a board of this mass would heat very slowly and with a somewhat smoother temperature profile graph.
The cycling up and down of the profile temperature, especially in the area between oven zones, was in this case caused by the boards large thickness. The surface of the board was quickly heated by the oven’s convection. Where that convection rate is lower, such as between air jet holes and between zones, the inner core of the board, which is not yet as hot as the surface due to the boards low thermal conductivity, pulls the surface temperature down toward the core temperature. Then as the boards moves into a new zone or under a convection air hole, the surface temperature is again pushed back up to a higher temperature, creating the wavy up and down look to the profile. It’s important to remember that the thermal profile of very thick boards, depending on their internal thermal conductivity, may behave like this as they are reflow soldered, even though common sense may say they should have a much smoother profile look.








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