Archive for March, 2009

Thermally Sensitive Components and J-STD-075

 

Good solder joints are not enough.  A good reflow profile must consider component temperature limitations.

The new IPC standard released Dec 08, Classification of Non-IC Electronic Components for Assembly Processes, J-STD-075, calls for thermal classification of components, and recommends a marking system to help contract manufactures recognize component temperature limits during the soldering process.  Failures don’t show up during initial test, but much later on in the product’s life – often six months to two years later, and well below forecasts that drive pricing and warranty policies. ALL parts have temperature limits; and until we take the time to profile the process to which we subject these parts, we can’t know if we cause harm or not.

ECD has moved in that direction with our Thermal Quality Management (ThQM™) Program. We think this will give the industry the knowledge and tools to look at ALL components in the comprehensive light necessary. Equally important, it introduces a program and method of dialog between OEM and EMS provider on soldering process issues.

View full details here

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Thermocouple response time

The response time of a thermocouple is affected by several factors

The main factors affecting thermocouple response time are thermocouple bead size and the conducting medium including attachment method.

Thermocouples response time is measured as a “time constant.” The time constant is defined as the time required for a thermocouple’s voltage to reach 63.2% of its final value in response to a sudden change in temperature. It takes five time constants for the voltage to approach 100% of the new temperature value.

Thermocouples attached to a heavy mass will respond much slower than one that is left free standing because its value is governed by the temperature of the large mass.  A free standing (exposed or bare wire) thermocouple’s response time is a function of the wire size (or mass of the thermocouple bead) and the conducting medium.  A thermocouple of a given size will react much faster if the conducting medium is water compared to still air.

Here are some typical time constants of various free standing thermocouple bead sizes (bead size is typically 2 times the diameter of the wire) in these conducting mediums:

    Wire (AWG)    Bead Size (inches)      Still Air (sec)        Water (sec)
           42                    0.003                              0.07                      0.003
           40                    0.005                              0.25                       0.02
           36                    0.010                                 1                            0.05
           30                    0.020                                4                            0.17

NOTE: Remember it takes five time constants for a thermocouple to reach 100% of the final temperature value so the above time constants must be multiplied by 5 to get the total time.

Commone thermocouple bead size is twice the wire diameter

So the most common sizes (30 AWG or smaller) of thermocouples used to attach to surfaces or components will have fast enough response time to accuracelly measure the temperatures of reflow solder process which tend to change no faster then 5 degrees/second. If one wishes to measure the air temperature, 36 AWG is common since the air is always moving, and the chart reflects “still air” response times.

The main reason for selecting thermocouples of a specific size is to match the size of the surface or point where the thermocouple is to sense temperature. 36 AWG is a good compromise between cost, size, and strength. Much smaller and it is too easy to break. Much bigger and it may be bigger then the component or attachment point.

One other factor in selecting thermocouples is the heat source. In wave soldering, the heat is typically from the bottom of the assembly and the thermocouples are attached on top. Here the thermocouples will be cooler then bottom of the assembly causing them the sink the heat as it flows from the bottom to the top. Smaller thremocouples will reduce  the heat sinking effect.

In reflow soldering, both the top and the bottom of the assembly are heated at about the same rate causing the thermocouple wire and its bead to heat as fast as the assembly.  Some times the thermocouple can heat faster then the assembly because it is closer to the heat source and can act as a heat source to the component. This is often true where there is exposed thermocouple wire where the insulation has pulled back from the bead more then 0.5 inches. Keeping the insulation closer to the bead prevents this in most cases.

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Thermocouple Size or Gauge

There is more than one way to specify thermocouple size.

Thermocouples are made when two conductors (wires) of different metals (alloys) are connected together to form a “junction.”  This junction, or connection between the two conductors, is typically made by melting the two conductors together using a torch or a flash welding process. The size of the thermocouple is typically specified by the size of the two conductors, however, rather then the size of the junction formed where the conductors are melted together. The junction size is typically 2.5 time the wire diameter or less.  Since the junction can vary somewhat, it is not the best way to specify the thermocouple size. So we us the wire size. Below are several of the most common ways to specify the size of a thermocouple:

  • Gauge (American Wire Gauge, or AWG)
    Wire gauge is common in the US and has meaning in the electronic and electrical fields. It’s handy because it keeps you from having to say (or write) long decimal numbers like 0.005 inches in diameter when you can just say 36 gauge. However, it’s upside-down in that as gauge number goes up, wire diameter goes down. There is a ratio between the gauge size and the diameter in inches:

 

Wire Diameter (inches) = 0.005 * (92^((36-AWG)/39))

As messy as this is, we still use AWG to call out thermocouple wire size. Here is a table of some common wire gauge sizes and their diameters in inches:

AWG            Diameter (inches)
22                   0.0253
24                   0.0201
26                   0.0159
28                   0.0126
30                   0.0100
32                   0.008
34                   0.0063
36                   0.005
38                   0.004
40                   0.0031

 

  • Wire diameter
    We also size  thermocouple wire by the diameter of the conductors. Each of the two conductors will be the same diameter, of course. See the above table for typical conductor conductor diameters use in the US.
  • Square Millimeters (mm²)
    Most other countries in the world use what’s called cross sectional area to specify the wire size. This is nothing more then the area of the circle formed by the conductor if you were to look flat at the end of the conductor. You know the area of a circle is:

Area =∏*radius²

And since the rest of the world is metric, this area is in millimeters (mm²). Common wire sizes are in nice round mm² numbers which means common sizes do not match up well with the AWG sizes.  The table below shows the mm² sizes for the AWG gauge sizes:
AWG                mm²
22                   0.326
24                   0.205
26                   0.129
28                   0.081
30                   0.051
32                   0.032
34                   0.020
36                   0.013
38                   0.008
40                   0.005

The most common thermocouple wire gauge sizes used for reflow or wave  soldering in the US are: 30 and 36 AWG, and some 40 AWG
A common size in other countries is 0.03 mm², which as you can see from the table above is neither 30 nor 36, but real close to 32 AWG. The method used to specify a thermocouple size really depends on where (what country) you are buying it from. Although we can all convert, and most make equivalent sizes, what you will hear on the street will be AWG size in the US and area in millimeters most anywhere else in the world.

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“Wavy” Reflow Profiles

Profile temperature measurements that cycle up and down

Profile temperature measurements that cycle up and down

Why are some profiles more wavy than others?

 Wavy looking profiles may be caused by something not always expected. In this case we were reflow soldering a very large and thick board; a back plane board that was 14 inches wide and 30 inches long and over 0.25 inches thick. One would expect that a board of this mass would heat very slowly and with a somewhat smoother temperature profile graph.

The cycling up and down of the profile temperature, especially in the area between oven zones, was in this case caused by the boards large thickness. The surface of the board was quickly heated by the oven’s convection. Where that convection rate is lower, such as between air jet holes and between zones, the inner core of the board, which is not yet as hot as the surface due to the boards low thermal conductivity, pulls the surface temperature down toward the core temperature. Then as the boards moves into a new zone or under a convection air hole, the surface temperature is again pushed back up to a higher temperature, creating the wavy up and down look to the profile. It’s important to remember that the thermal profile of very thick boards, depending on their internal thermal conductivity, may behave like this as they are reflow soldered, even though common sense may say they should have a much smoother profile look.

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Box and Whisker Plots

Box whisker plots are particularly useful for illustrating  change variations between different data sets.

boxplot1Box-whisker plots are a great way to show how stable the different thermocouple attachment methods are relative to each other.

The top dot is the Maximum value and the bottom dot is the Minimum value from the data set. The top of the box is the 75th Percentile (AKA: 3rd Quartile) and the bottom of the box is the 25th Percentile (AKA: 1st Quartile). This makes the Median, the red dot, the 50th Percentile (AKA: 2nd Quartile). Percentile is a number describing the data set such that the K-th Percentile is a number such that K % of all data values are less and (100 – K) % are larger than it, or to be more precise, at least K% of the sorted values are less than or equal to it and at least (100 – K) % of the values are greater than or equal to it.

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Aluminum Foil – Framed in Kapton Tape

Thermocouple Attachment – Aluminum Foil with Kapton Tape

 ch5alfoilframedright

Aluminum foil promotes solid contact with surfaces – Kapton tape adds adhesion insurance

What are some advantages of Aluminum Foil Framed in Kapton Tape?

Easy to remove without damage to product
Stable – good long term
Allows use of smaller pieces of foil while maintaining adhesion

What are some of the disadvantages of Aluminum Foil Framed in Kapton Tape.

Two step operation requires more time

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Sticky T/C – M.O.L.E.® AttachEz™

Thermocouple Attachment – Sticky T/C – M.O.L.E.® AttachEz™

 Sticky-TC Thermocouple on PCB Surface

The Sticky T/C is easy to attach and remove multiple times

What are some advantages of Sticky T/C?

Quick and easy to attach and remove

Does not damage product
Can be attached to metals and plastics
Provides identification of instrument input channel number
Able to see through and accurately place thermocouple

What are some of the disadvantages of Sticky T/C.

Not usable with small or irregular surfaces such as component leads

Product Information Here

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Temprobe®

Thermocouple Attachment – Temprobe®

 ch16tempprobeleft

The Temprobe is the easiest to use and remove attachment method

What are some advantages of Temprobe?

Quick and easy to attach and remove

Works well on “wet” solder paste

Does not damage product
Can be attached to metals and plastics
Sheathed construction protects thermocouple

 

What are some of the disadvantages of Temprobe.

Requires 1/2- 3/4  inch virtical clearence above board in oven

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Epoxy – Air Cured

Thermocouple Attachment - Epoxy

 Thermocouple Attached with High-Temp Epoxy

Air Dry Epoxy provides solid contact but requires time to cure

What are some advantages of Epoxy?

Stable – good long term
Can be attached to metals and plastics

Easy to see

What are some of the disadvantages of Epoxy.

Proper cure may require hours
Difficult to remove without damaging product
Difficult to recover thermocouple

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Aluminum Foil – Adhesive Backed

 Thermocouple Attachment – Aluminum Foil

 Thermocouple Attached with Aluminum Tape

Aluminum foil promotes solid contact with surfaces

What are some advantages of Aluminum Foil?

Easy to apply
Easy to remove without damage to product
Stable – good long term
Accurate – Can be attached to very small components

What are some of the disadvantages of Aluminum Foil.

Does not work well with very small contact areas such as component leads
Cannot see through it to know where thermocouple is placed

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